Improving Liquid Film Thickness Uniformity of Semiconductor Etching Equipment Using Flow Field Visualization and CFD Simulation

Lin, Tee; Hu, Ming-Hsuan; Zargar, Omid Ali; Lai, Wei-Hao; Leggett, Graham

doi:10.1109/tsm.2022.3147190

Cited by 4 publications

(2 citation statements)

References 12 publications

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“…Owing to the development of the semiconductor industry, the requirement for a clean air environment in clean workshops is becoming more important. 1,2 The semiconductor production process generates a significant amount of exhaust gases, which can damage the air quality in the workshop through a fresh-air system, thus causing environmental pollution and adversely affecting semiconductor production. Therefore, to achieve clean semiconductor production, one must understand the diffusion characteristics of gaseous pollutants in the workshop.…”

Section: Introductionmentioning

confidence: 99%

Effects of contaminant diffusion on the fresh air inlets of a clean room workshop

Xu,

Qian,

Zhang

2024

Building Services Engineering Research and Technology

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In this study, a clean workshop is the subject of our research study, and computational fluid dynamics methods are applied to investigate the effect of exhaust pipe height, exhaust velocity, barrier structure, and wind direction on contaminant diffusion from the clean workshop. Results show that an increase in exhaust pipe height and exhaust velocity or a decrease in barrier height can effectively reduce the pollutant concentration at each fresh air inlet (FAI). Along the wind direction, the contaminant concentration initially increases and then decreases as distance increases. When the height of the exhaust pipe reaches 45 m, the effect of pollutants on the FAI is insignificant. When the exhaust velocity reaches 12 m/s, the effect of pollutants on the FAI weakens as the emission speed of flue gas increases. Reducing the height of the barrier to 29–31 m can effectively improve the concentration of pollutants at each FAI. Practical implications The mechanism by which the exhaust pipe height, exhaust velocity, barrier structure, and wind direction affect pollutant diffusion from a clean room workshop is systematically investigated by combining the CFD methods with an actual clean workshop as the research object, and the optimal pollutant reduction conditions are presented, thus providing scientific guidance for the construction of clean plants and the reduction of pollutant emissions.

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Section: Introductionmentioning

confidence: 99%

Effects of contaminant diffusion on the fresh air inlets of a clean room workshop

Xu,

Qian,

Zhang

2024

Building Services Engineering Research and Technology

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“…In the wet processes of semiconductor manufacturing, such as resist removal and cleaning, the surface etch rate is the most important parameter and must be accurately predicted. In the semiconductor manufacturing process, which has changed from a batch type to a single wafer type [1], the surface etch rate depends not only on the concentration and temperature of the chemical solution but also on the thickness and velocity distribution of the liquid film on the wafer surface [2][3][4][5], so it is necessary to clarify the flow conditions on the wafer surface. Although the liquid film structure on the wafer surface has been well investigated for single liquid jet flows [6][7][8], the liquid film structure formed on the sprayed surface for two-fluid jets needs to be clarified.…”

Section: Introductionmentioning

confidence: 99%

Measurement of Liquid Film Thickness Distribution Formed on a Two-fluid Jet Sprayed Surface Using a Fiber Optic Probe

Watanabe,

Mizushima,

Takahashi

et al. 2023

J. Photopol. Sci. Technol.

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In single-wafer wet processes, the surface etch rate is strongly dependent not only on the concentration and temperature of the chemicals but also on the structure of the formed liquid film flow. The two-fluid jet method, widely used in the single wafer process, will cause a different liquid film structure from the single liquid jet. In this study, we investigated the liquid film structure formed by a two-fluid jet where many droplets are sprayed with a highvelocity air stream. Using a fiber-optic probe, we measured the liquid film thickness distribution by changing the air and water flow rate. The liquid film just below the irradiation is thicker than the single liquid jet and rapidly decreases around it, and circular hydraulic jumps occur at a greater distance. The jump radius varied significantly depending on the air flow rate and the temperature of the liquid. The different liquid film structure formed by the two-fluid jet differs in the areas that are just below the irradiation and hydraulic jump, expected different chemical reactions occur.

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Simulations of Modified Shallow Water Equation and Reaction Kinetics of Poly Etching on Single Wafer Process

Yan

Okamoto

2023

IEEE Trans. Semicond. Manufact.

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Improving Liquid Film Thickness Uniformity of Semiconductor Etching Equipment Using Flow Field Visualization and CFD Simulation

Cited by 4 publications

References 12 publications

Effects of contaminant diffusion on the fresh air inlets of a clean room workshop

Effects of contaminant diffusion on the fresh air inlets of a clean room workshop

Measurement of Liquid Film Thickness Distribution Formed on a Two-fluid Jet Sprayed Surface Using a Fiber Optic Probe

Simulations of Modified Shallow Water Equation and Reaction Kinetics of Poly Etching on Single Wafer Process

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