Improving dimensional stability at high temperature and toughness of polyimide films via adjustable entanglement density

Jiang, Yi; Liu, Changyao; Tian, Yiyao; Wang, Ke; Li, Xiangyang; Luo, Longbo

doi:10.1016/j.polymer.2021.123488

Cited by 28 publications

(21 citation statements)

References 45 publications

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“…图 8 不同取代联苯结构的二面角与构象能量关系 [29] (网络版彩图) 为抑制局部分子运动对薄膜热膨胀的影响，在结构中引入羟基、酯基、酰胺、噁唑等功能基团增大分子间相互作用，可调节薄膜的热膨胀行为 [47][48][49][50][51] . 大量研究证实，分子间相互作用的提高可有效抑制局部分子运动，改善聚酰亚胺薄膜在面内方向的热膨胀性能，但目前仍缺少对薄膜热膨胀行为的影响研究.…”

Section: 局部分子运动unclassified

Research progress in thermal expansion behavior of polyimide films

Wang¹,

Zhai²,

Gao³

et al. 2022

Sci. Sin.-Chim

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As one of the most important flexible substrates and interlayer dielectric materials, the thermal expansion performance of polyimide films has always attracted great interest. Especially with the development of advanced electronic and microelectronic devices, the linear and volumetric thermal expansion of polyimide films are facing more and more stringent requirements. In order to explore new generation polyimide films with low thermal expansion, it is necessary to clarify the thermal expansion behaviors and influence mechanism. For polymer films, the thermal expansion actually includes in-plane and out-of-plane linear as well as volumetric thermal expansion. Most researches on thermal expansion of polyimide films are focused on the in-plane thermal expansion, but there are few studies on the out-of-plane and volume thermal expansion of films. There is no systematic understanding of comprehensive and anisotropic of thermal expansion of films. The research on linear and volume thermal expansion behavior of polyimide films were firstly summarized in this paper. The testing methods were introduced in detail, including thermomechanical analysis (TMA), variable temperature wide-angle X-ray diffraction (VT-WAXD), capacitance technique, optical interferometry, etc. The influencing factors of thermal expansion behavior of polyimide films were discussed, such as molecular backbone structures, local molecular motions, chemical crosslinking, aggregation structures and film preparation process. The relationship between structures and processes on in-plane, out-of-plane linear and volumetric thermal expansion behavior of polyimide films was clarified. The problems and challenges in the future research on thermal expansion were prospected. This review can provide a necessary guidance for the development of high-performance polyimide films with low thermal expansion during wide temperature range.

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Section: 局部分子运动unclassified

Research progress in thermal expansion behavior of polyimide films

Wang¹,

Zhai²,

Gao³

et al. 2022

Sci. Sin.-Chim

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“…[5][6][7][8][9] Aromatic PIFs contain benzene and imide rings in their molecular chains, [10,11] which endow them with exceptional mechanical properties (such as compression and impact performance, mechanical flexibility, etc. ), [12][13][14][15] thermal properties (i.e., thermal DOI: 10.1002/mame.202100941 stability, high and low temperature resistance, flame retardant, thermal insulation among others), [16][17][18][19] and prominent chemical resistance (corrosion resistance, radiation resistance, etc.). [20,21] Thus, developing aromatic flexible PIFs is becoming the core research interest to suit the stringent requirements for applications in high-tech fields.…”

Section: Introductionmentioning

confidence: 99%

Combining Microwave‐Assisted Foaming and Post Curing Process to Prepare Lightweight Flexible Polyimide Foams for Thermal Insulation Applications

Luo

Qiu

et al. 2022

Macro Materials & Eng

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Lightweight flexible polyimide foams (PIFs) with different rigid‐flexible molecular structure networks are prepared by microwave‐assisted foaming of polyester ammonium salt (PEAS) precursor powders, followed by post curing process to complete final imidization. The optimum foaming temperatures of PEAS precursors range from 85 to 135 °C, and the melting rate of PEAS is adjusted to meet the volatile releasing rate to fabricate PIFs. Results show that PIFs with nearly fully open cell rate (99.99%), micron pore sizes (400–500 µm), and micro/nano multiscale structures exhibit excellent mechanical flexibility and elasticity. The prepared PIFs demonstrate exceptional thermal stability and heat resistance in both dynamic and static environments. The PIFs possess low thermal conductivity and superior thermal insulation properties that demonstrate potential applications in high‐tech fields such as aerospace, marine use, and microelectronics among others.

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“…Thus, moieties which can prompt inter-and intra-molecular interactions, such as amide, pyridine, pyrimidine, benzimidazole, have been introduced into CPIs to improve their mechanical properties and dimensional stability. [29][30][31] For instance, Hasegawa et al developed a series of CPIs through the combination of CBDA, 6FDA, TFMB, and novel ester or amide-containing monomers. Some of these CPIs with amide moieties exhibited good solubility in organic solvents, low CTE (<15 ppm K À1 ), excellent optical transparency, and high tensile strength (up to 278 MPa), modulus (>6 GPa), and elongation-at-break (>10%).…”

Section: Introductionmentioning

confidence: 99%

“…However, their relatively low moduli and poor solubility in organic solvents limit their practical applications. Thus, moieties which can prompt inter‐ and intra‐ molecular interactions, such as amide, pyridine, pyrimidine, benzimidazole, have been introduced into CPIs to improve their mechanical properties and dimensional stability 29–31 . For instance, Hasegawa et al developed a series of CPIs through the combination of CBDA, 6FDA, TFMB, and novel ester or amide‐containing monomers.…”

Section: Introductionmentioning

confidence: 99%

Colorless poly(amide‐imide) copolymers for flexible display applications

Zhang

Zhou²,

Wang

et al. 2022

J of Applied Polymer Sci

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Colorless polyimide (CPI) films showed great potential for flexible display applications due to their unique combination of excellent optical transparency, and outstanding thermal and mechanical properties. Herein, a series of colorless poly(amide‐imide)s were prepared via a conventional two‐step method, using 1,2,3,4‐cyclobutanetetracarboxylic dianhydride (CBDA), 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA), 2,2′‐bis(trifluoromethyl)benzidine (TFMB), and 4,4′‐diaminobenzanilide (DABA) as the monomers. The thermal, mechanical, and optical properties of these copolymers were optimized by adjusting the molar ratios of these monomers. The amide linkages significantly improved the mechanical properties and dimensional stability of the resultant CPI films due to strong hydrogen bonding interactions. In particular, CPI‐f films with monomer compositions of TFMB (50 mol%), DABA (50 mol%), 6FDA (50 mol%), and CBDA (50 mol%) exhibited tensile strength of 177 MPa, modulus of 5.5 GPa, coefficient of thermal expansion value of 18 ppm K−1, and glass transition temperature of 394°C. Furthermore, the optical properties of these copolymers were well balanced due to the adoption of CBDA, which can suppress the formation of charge transfer complexes. Specifically, these CPI films displayed transmittance at 550 nm of >88%, b* values of <5.5, haze values of <1%. The aforementioned results revealed that copolymerization is an effective strategy to achieve CPIs with excellent comprehensive properties.

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Improving dimensional stability at high temperature and toughness of polyimide films via adjustable entanglement density

Cited by 28 publications

References 45 publications

Research progress in thermal expansion behavior of polyimide films

Research progress in thermal expansion behavior of polyimide films

Combining Microwave‐Assisted Foaming and Post Curing Process to Prepare Lightweight Flexible Polyimide Foams for Thermal Insulation Applications

Colorless poly(amide‐imide) copolymers for flexible display applications

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