Proceedings of the 38th Design Automation Conference (IEEE Cat. No.01CH37232)
DOI: 10.1109/dac.2001.935525
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Improving bus test via I/sub DDT/ and boundary scan

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“…In [20], the authors present a method to detect defects in SoC interconnections using I DDT test (analyzing the variation of the dynamic current), boundary scan and tests of delay. A built-in self-test (BIST) methodology for testing the inter router links of a No-Chas been proposed in [21] considering the Maximum Aggressor Fault (MAF) model.…”
Section: Fault and Test Modelsmentioning
confidence: 99%
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“…In [20], the authors present a method to detect defects in SoC interconnections using I DDT test (analyzing the variation of the dynamic current), boundary scan and tests of delay. A built-in self-test (BIST) methodology for testing the inter router links of a No-Chas been proposed in [21] considering the Maximum Aggressor Fault (MAF) model.…”
Section: Fault and Test Modelsmentioning
confidence: 99%
“…All routers are capable of using the lightweight adaptive routing (LAR) and data splitting (DS), however only the ones with faulty interconnections uses one of these techniques in order to minimize the overheads according to the fault case. By using test and diagnosis [10,[19][20][21], each router is configured with the information relative to the faulty interconnections (registers in each channel receive the information about faulty interconnections and multiplexers from DS technique receive the information about the specific faulty wires). In presence of defects, LAR technique is always the first choice, because it has minimal impact in communication time and power.…”
mentioning
confidence: 99%