Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing

Jeong, Ikhyun; Koo, Seung-Woo; Kim, Hyun-Sok; jung-il, hwang; Lee, Dong Hoon; Kim, Min-Shik; Ju, Jae-Wuk; Lee, Kang‐Min; Kim, Young‐Sik; Lambregts, Cees; Rahman, Rizvi; Hauptmann, Marc; Pishkari, Raheleh; Boustheen, A Allwyn; Hu, Kwang-Young; Böcker, Paul; Lee, Dong-Hak; Joo, In-Ho; Lee, Kang-San

doi:10.1117/12.2552028

Metrology, Inspection, and Process Control for Microlithography XXXIV 2020

DOI: 10.1117/12.2552028

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Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing

Ikhyun Jeong

Seung-Woo Koo

Hyun-Sok Kim

et al.

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Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing

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