Improvement of β-SiC Synthesis Technology on Silicon Substrate
Yana Suchikova,
Sergii Kovachov,
Ihor Bohdanov
et al.
Abstract:This article presents an enhanced method for synthesizing β-SiC on a silicon substrate, utilizing porous silicon as a buffer layer, followed by thermal carbide formation. This approach ensured strong adhesion of the SiC film to the substrate, facilitating the creation of a hybrid hetero-structure of SiC/por-Si/mono-Si. The surface morphology of the SiC film revealed islands measuring 2–6 μm in diameter, with detected micropores that were 70–80 nm in size. An XRD analysis confirmed the presence of spectra from … Show more
“…Additionally, there are techniques such as patterning the growth on undulant silicon using diamond slurry [12], growing 3C-SiC on fine-structured nm-scale hexagonal pillars [13] and trapping defects within inverted Si pyramids [14]. The growth of 3C-SiC on porous Si has also been explored to improve adhesion and reduce lattice mismatch between the thin film and substrate [15]. The use of compliant substrates such as these offers a reduction in defects and also the potential to suppress wafer bow; however, several of these methods rely on precise fabrication techniques that are dependent on the substrate's crystal orientation.…”
We demonstrate the growth of 3C-SiC with reduced planar defects on a micro-scale compliant substrate. Heteroepitaxial growth of 3C-SiC on trenches with a width and separation of 2 µm, etched into a Si(001) substrate, is found to suppress defect propagation through the epilayer. Stacking faults and other planar defects are channeled away from the center of the patterned structures, which are rounded through the use of H2 annealing at 1100 °C. Void formation between the columns of 3C-SiC growth acts as a termination point for defects, and coalescence of these columns into a continuous epilayer is promoted through the addition of HCl in the growth phase. The process of fabricating these compliant substrates utilizes standard processing techniques found within the semiconductor industry and is independent of the substrate orientation and offcut.
“…Additionally, there are techniques such as patterning the growth on undulant silicon using diamond slurry [12], growing 3C-SiC on fine-structured nm-scale hexagonal pillars [13] and trapping defects within inverted Si pyramids [14]. The growth of 3C-SiC on porous Si has also been explored to improve adhesion and reduce lattice mismatch between the thin film and substrate [15]. The use of compliant substrates such as these offers a reduction in defects and also the potential to suppress wafer bow; however, several of these methods rely on precise fabrication techniques that are dependent on the substrate's crystal orientation.…”
We demonstrate the growth of 3C-SiC with reduced planar defects on a micro-scale compliant substrate. Heteroepitaxial growth of 3C-SiC on trenches with a width and separation of 2 µm, etched into a Si(001) substrate, is found to suppress defect propagation through the epilayer. Stacking faults and other planar defects are channeled away from the center of the patterned structures, which are rounded through the use of H2 annealing at 1100 °C. Void formation between the columns of 3C-SiC growth acts as a termination point for defects, and coalescence of these columns into a continuous epilayer is promoted through the addition of HCl in the growth phase. The process of fabricating these compliant substrates utilizes standard processing techniques found within the semiconductor industry and is independent of the substrate orientation and offcut.
“…Solar photovoltaic technology has developed rapidly in the last ten years due to its environmental friendliness and sustainability [1][2][3][4][5][6][7][8]. As global energy demand increases, the conversion of solar energy into electrical energy emerges as an alternative.…”
Photovoltaic (PV) solar panels suffer from efficiency losses due to the accumulation of dust on their surface during operation, as well as the loss of transparency in the top glass. The efficiency can be increased when hydrophobic films are deposited on the top glass of the solar cells. The top glass of solar cells must have three characteristics: high transmittance in the 380–750 nm range, a band gap greater than 3.2 eV and a refractive index higher than 1.23. So, the films require the same characteristics. This work presents an increase in the contact angle (related to an increase in the hydrophobic character) when Ta2O5 is partially substituted with ZnO. The studied films, physically deposited on glass by e-gun technology, present a non-crystalline state in the form of the X-ray patterns shown. The films have a transmission of 75%–80% in the visible range. The morphology and roughness of the coatings were evaluated by atomic force microscopy. All films show the values of the Millipore water contact angle higher than 91 degrees, leading to the acquisition of hydrophobic properties on the surface. In comparison, the substrate is hydrophilic, with an average contact angle of 53.81 ± 2.16. The hydrophobic properties and self-cleaning ability make the films recommendable for application. The band gap of the coatings was calculated with the Tauc method, and they have values of 4.5–4.6 eV.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.