Improvement of transparent conductive properties of Cu films by introducing H2 into deposition atmosphere during RF magnetron sputtering

Zhu, B.L.; Yi, Cancan; Zhao, Xinglei; Ma, Junjie; Wu, Jun; Shi, Xinwei

doi:10.1016/j.spmi.2020.106628

Cited by 4 publications

(1 citation statement)

References 34 publications

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“…Magnetron sputtering technology is widely used in the preparation of conductive films such as Cu owing to its low deposition temperature [1][2][3][4], accurate and controllable film composition and thickness, and smooth film surface. However, the microstructure and properties of films deposited by conventional direct-current magnetron sputtering (DCMS) are not ideal because of the low plasma density (10 14 -10 16 m −3 ) [5] and the low ionization rate of the deposited particles.…”

Section: Introductionmentioning

confidence: 99%

Influence of Target Current on Structure and Performance of Cu Films Deposited by Oscillating Pulse Magnetron Sputtering

et al. 2022

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To improve the deposition rate of thin films, a novel oscillating pulse magnetron sputtering technology (OPMS) was developed to substitute the traditional high-power impulse magnetron sputtering (HiPIMS). Meanwhile, the relative density and the mechanical properties were also significantly enhanced by this method. In this study, OPMS was used to prepare the pure Cu film, and the effect of the target current on the mode of copper atoms leaving the target (off-target method) under argon gas atmosphere was also investigated. The results showed that with the increase of the target current, the off-target method of copper atoms was transformed from sputtering to evaporation, the surface cracks’ width of the deposited films gradually decreased, and the lattice constants of the Cu films were close to the bulk materials. Furthermore, the deposition rate of Cu films obviously increased from 19 to 103 nm/min. The crystal structures of Cu films showed a face-centered cubic structure, and the grain size increased from 13 to 18 nm, with the target current increased from 2 to 18 A. Moreover, Cu films deposited at currents of 8 and 13 A exhibited excellent adhesion.

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Section: Introductionmentioning

confidence: 99%

Influence of Target Current on Structure and Performance of Cu Films Deposited by Oscillating Pulse Magnetron Sputtering

et al. 2022

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Effects of oxidation on the localized surface plasmon resonance of Cu nanoparticles fabricated via vacuum coating

Fang

Cheng

Wang

et al. 2021

Vacuum

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Tailoring of structual, optical, and electrical properties of Cu films by sputtering power and deposition atmosphere

Zhu

Yin

et al. 2022

Journal of Vacuum Science &Amp; Technology B

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In order to effectively modify the structure and optical-electric properties of Cu films and thus provide guidance for the development of high-performance transparent electrodes based on ultrathin Cu films, different thicknesses of Cu films were prepared by magnetron sputtering under three different sputtering powers and atmospheres (34 W and Ar, 136 W and Ar, and 34 W and Ar + H2). The results show that both increasing the sputtering power and introducing H2 into the sputtering atmosphere can improve film crystallinity, electrically conductive properties, and transparency of the film. Increasing the sputtering power can increase deposition rate, decrease surface roughness, improve stability in air, and help the formation of continuous films, but introducing H2 into the sputtering atmosphere can decrease deposition rate, increase surface roughness, degrade stability in the air, and hinder the formation of continuous films. In addition, the mechanisms of increasing the sputtering power or introducing H2 to affect the crystallinity, surface roughness, and the formation of continuous films are discussed.

show abstract

Improvement of transparent conductive properties of Cu films by introducing H2 into deposition atmosphere during RF magnetron sputtering

Cited by 4 publications

References 34 publications

Influence of Target Current on Structure and Performance of Cu Films Deposited by Oscillating Pulse Magnetron Sputtering

Influence of Target Current on Structure and Performance of Cu Films Deposited by Oscillating Pulse Magnetron Sputtering

Effects of oxidation on the localized surface plasmon resonance of Cu nanoparticles fabricated via vacuum coating

Tailoring of structual, optical, and electrical properties of Cu films by sputtering power and deposition atmosphere

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