Improvement of the Thermal Resistance of Thin Film Heaters on Glass Substrate for Lab-on-Chip Applications

Scorzoni, A.; Tavernelli, Michele; Placidi, P.; Valigi, Paolo; Zampolli, S.; Caputo, D.; Petrucci, Giulia; Nascetti, A.

doi:10.1016/j.proeng.2014.11.316

Cited by 3 publications

(1 citation statement)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…An acceptable precision is achievable in the range of the fill factor FF ps = 0.7 − 0.85. The fill factor can be altered by varying the isolation distance η according to Equation (8). Additionally, it is a good design practice for η to be accepted as little as possible at the beginning of the design procedure, as it will be resized after the final number of traces is calculated.…”

mentioning

confidence: 99%

An Analysis, Numerical Modeling and Experimental Verification of Low-Temperature Thermofoil Heaters

Dimitrov

2020

Eng

View full text Add to dashboard Cite

In this paper, an analysis of the geometry, numerical modeling, and experimental verification of thermofoil heaters for low-temperature applications is presented. The research suggests a calculation procedure of the thermofoil traces’ geometry, comprising the necessary electrical and thermal parameters in order for the characteristics of the heater to be fully defined according to the stipulated conditions required. The derived heaters’ geometry analysis procedure is depicted with two case studies, giving the sequence of the necessary calculations and their applications as part of a design task. Its continuation, the design approach, is developed with numerical modeling, based on Finite Element Methods (FEM) used for multiphysics simulations, including the thermal and electrical heaters parameters. The realized 3D models are used to depict the uniformity of the thermal field in the system heatsink-thermofoil heater. The results from analysis, modeling, and simulations are tested experimentally. The suggested geometry analysis and modeling approach are experimentally verified. The final results demonstrate satisfactory precision with a simulation–experiment mismatch in a range of 5–7%. As a vital product of experimental research, the maximum power density for the studied thermofoil heaters is derived for a range of temperatures and material characteristics.

show abstract

mentioning

confidence: 99%

An Analysis, Numerical Modeling and Experimental Verification of Low-Temperature Thermofoil Heaters

Dimitrov

2020

Eng

View full text Add to dashboard Cite

show abstract

Thermal characterization of thin film heater for lab-on-chip application

Petrucci

Caputo

Nascetti

et al. 2015

2015 XVIII AISEM Annual Conference

View full text Add to dashboard Cite

This paper presents the design, fabrication and characterization of a thin film heater functional for thermal treatments in lab-on-chip system. The spatial temperature distribution determined by different heater geometries has been studied through electro-thermal simulations by using COMSOL Multiphysics. The heater showing the more uniform temperature distribution has been subsequently fabricated and characterized. A very good agreement between modeled and measured data has been attained. Results show a spatial temperature distribution of about ±1°C over an area comparable to the heater area and a directly USB powered heater, demonstrating the suitability of the proposed device for lab-on-chip thermal applications

show abstract

Thermal control system based on thin film heaters and amorphous silicon diodes

Lovecchio

Petrucci

Caputo

et al. 2015

2015 6th International Workshop on Advances in Sensors and Interfaces (IWASI)

View full text Add to dashboard Cite

In this paper we present a system able to perform thermal treatments on lab-on-chip devices fabricated on glass substrates. The system includes a thin film resistor acting as heater and thin film hydrogenated amorphous silicon diodes acting as temperature sensors. An electronic system controls the lab-on-chip temperature through a Proportional-IntegralDerivative algorithm. In particular, an electronic board infers the system temperature measuring the voltage across the amorphous silicon diodes and drives the heater to achieve the set-point temperature. Taking into account the 16-bit ADC resolution and the sensors sensitivity, which is around 3.6 mV/C, we estimate that our system is able to detect temperature variation as low as 3.5·10-3 C

show abstract

Improvement of the Thermal Resistance of Thin Film Heaters on Glass Substrate for Lab-on-Chip Applications

Cited by 3 publications

References 5 publications

An Analysis, Numerical Modeling and Experimental Verification of Low-Temperature Thermofoil Heaters

An Analysis, Numerical Modeling and Experimental Verification of Low-Temperature Thermofoil Heaters

Thermal characterization of thin film heater for lab-on-chip application

Thermal control system based on thin film heaters and amorphous silicon diodes

Contact Info

Product

Resources

About