2020
DOI: 10.1109/led.2020.2968629
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Improvement of Resistive Switching Characteristics in Zinc Oxide-Based Resistive Random Access Memory by Ammoniation Annealing

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Cited by 20 publications
(6 citation statements)
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“…This ammonium‐doped device achieves low breakdown voltage during the forming process and low power consumption during the SET/RESET process. [ 119 ] As shown in Figure 4c, the ON and OFF current are reduced by ≈50% and 80%, respectively.…”
Section: Rs Device and Performance Improvementmentioning
confidence: 96%
“…This ammonium‐doped device achieves low breakdown voltage during the forming process and low power consumption during the SET/RESET process. [ 119 ] As shown in Figure 4c, the ON and OFF current are reduced by ≈50% and 80%, respectively.…”
Section: Rs Device and Performance Improvementmentioning
confidence: 96%
“…In this review, we will present RRAM-related inorganic materials with oxides, solid electrolyte and two-dimensional (2D) materials. [9,20,75], NiO [8,12,76], TiO 2 [21,77,78], HfO 2 [60,79,80], ZnO [81][82][83], and ZrO 2 [22,84,85] are always playing main roles in materials application of RS medium. The first report of RS performance in binary metal oxides was proposed by Hickmott in 1962 [91], which demonstrated the RS characteristics of Al/Al 2 O 3 /Al device under the effect of an electric field.…”
Section: Thin Film Materials Of Rs Mediummentioning
confidence: 99%
“…As one of the most typical representatives of oxides, binary oxides have been explored for over half a century due to their simple composition, low manufacture cost, compatibility with traditional CMOS (complementary metal-oxide-semiconductor transistor) technology, and ease of fabrication and control. Among binary oxides, binary metal oxides such as Al 2 O 3 [ 9 , 20 , 75 ], NiO [ 8 , 12 , 76 ], TiO 2 [ 21 , 77 , 78 ], HfO 2 [ 60 , 79 , 80 ], ZnO [ 81 , 82 , 83 ], and ZrO 2 [ 22 , 84 , 85 ] are always playing main roles in materials application of RS medium.…”
Section: Thin Film Materials Of Rram Devicesmentioning
confidence: 99%
“…Therefore, the RRAM must exhibit a certain level of thermal stability to ensure compatibility with the CMOS process. However, most studies on RRAM-based memristors have focused on improving the electrical characteristics of the device, whereas only a few studies pertaining to thermal degradation have investigated the effect of postdeposition annealing processes prior to TE deposition. As the operation of RRAM is primarily determined by the conducting filament (CF) of oxygen vacancies formed in the active layer, RRAM is susceptible to structural defects caused by the heat applied during annealing . In addition, the number of artificial synapses used in the implementation of neuromorphic systems is at least 10 4 and is expected to be significantly affected by thermal degradation.…”
Section: Introductionmentioning
confidence: 99%