“…4a and b, the composites with filler show an average complex permittivity of 19.0-j19.0 and tan d of 1.01 at 10 GHz, which are higher than the composites without filler, whose corresponding values are 17.0-j16.0 and 0.94 respectively. On one hand, the Ti 3 SiC 2 filler with a relative high e 0 value contributes to enhancing the e 0 of the composites according to the mixing rules [24]. On the other hand, quantities of interfaces are formed between the Ti 3 SiC 2 particles and SiC matrix with the incorporation of Ti 3 SiC 2 filler.…”
Section: Dielectric Properties Of Sic F /Sic Composites At High Tempementioning
confidence: 99%
“…The specific weight ratios of each component of SiC f /SiC composites are given in Table 1. It is worth noting that the weak proportion of micropores can be negligible in adjusting the dielectric properties owing to the rather low permittivity compared with other components of the composites [24].…”
Section: Microstructures and Mechanical Properties Of Sic F /Sic Compmentioning
confidence: 99%
“…The detailed preparation routes of the infiltrating slurry and final composites with Ti 3 SiC 2 filler were represented in Ref. [24]. The PIP cycles of the final composites were repeated for 9 times until the mass gain was less than 1 wt.%.…”
Section: Composites Preparation and Characterizationmentioning
confidence: 99%
“…From the mechanical standpoint, the incorporating filler can effectively improve the infiltration efficiency during the PIP process and act as strengthening phase to enhance the mechanical properties of the composites [24]. Thus, in the present work, titanium silicon carbide (Ti 3 SiC 2 ) was introduced into the polycarbosilane (PCS) precursor as inert filler to optimize the dielectric and EMI shielding properties of SiC f /SiC composites, owing to its nano-laminate structure, good electrical and thermal conductivities, low specific gravity, and excellent oxidation resistance at elevated temperatures [25].…”
“…4a and b, the composites with filler show an average complex permittivity of 19.0-j19.0 and tan d of 1.01 at 10 GHz, which are higher than the composites without filler, whose corresponding values are 17.0-j16.0 and 0.94 respectively. On one hand, the Ti 3 SiC 2 filler with a relative high e 0 value contributes to enhancing the e 0 of the composites according to the mixing rules [24]. On the other hand, quantities of interfaces are formed between the Ti 3 SiC 2 particles and SiC matrix with the incorporation of Ti 3 SiC 2 filler.…”
Section: Dielectric Properties Of Sic F /Sic Composites At High Tempementioning
confidence: 99%
“…The specific weight ratios of each component of SiC f /SiC composites are given in Table 1. It is worth noting that the weak proportion of micropores can be negligible in adjusting the dielectric properties owing to the rather low permittivity compared with other components of the composites [24].…”
Section: Microstructures and Mechanical Properties Of Sic F /Sic Compmentioning
confidence: 99%
“…The detailed preparation routes of the infiltrating slurry and final composites with Ti 3 SiC 2 filler were represented in Ref. [24]. The PIP cycles of the final composites were repeated for 9 times until the mass gain was less than 1 wt.%.…”
Section: Composites Preparation and Characterizationmentioning
confidence: 99%
“…From the mechanical standpoint, the incorporating filler can effectively improve the infiltration efficiency during the PIP process and act as strengthening phase to enhance the mechanical properties of the composites [24]. Thus, in the present work, titanium silicon carbide (Ti 3 SiC 2 ) was introduced into the polycarbosilane (PCS) precursor as inert filler to optimize the dielectric and EMI shielding properties of SiC f /SiC composites, owing to its nano-laminate structure, good electrical and thermal conductivities, low specific gravity, and excellent oxidation resistance at elevated temperatures [25].…”
“…The microwave absorption and mechanical properties of SiC CFRCMCs depend on complex permittivity, electrical conductivity and free carbon content of SiC bers, as well as interphase and matrix. The SiC ceramics matrix can be fabricated by chemical vapor in ltration (CVI) [11] , precursor impregnation and pyrolysis (PIP) [12] , liquid silicon in ltration (LSI) [13] and melt in ltration (MI) [14] . Among these techniques, the PIP method has many advantages, for instance, the designable molecular precursor of polymer derived ceramics (PDC), safe in operation and the feasibility of manufacture in large complex components.…”
The SiC bers are essential for designing microwave absorption and mechanical properties of multifunctional composites. In this study, SLF, KD-II and KD-S SiC bers were used to fabricate SiC f /SiC composites. The SLF SiC bers are composed by amorphous SiOC. The KD-II and KD-S SiC bers exhibit higher crystallizations and free carbon content. The conductivity of SLF, KD-II and KD-S SiC bers are 0.0127, 1.184 and 0.1316 S/cm, respectively. The exural strength of SLF, KD-II and KD-S SiC f /SiC composites are 147.77, 322.57 and 248.16 MPa, respectively. The microwave absorption property of the SLF SiC f /SiC composites can be obtained over-25 dB with a thickness of 2.3 mm and the effective absorption bandwidth (EAB) below-10 dB reaches 3.72 GHz with the thickness of 2.7 mm. In contrast, the KD-II SiC f /SiC composites only reach-3.6 dB in the whole X band when the thickness varies from 2 to 2.9 mm. KD-S SiC f /SiC composites can be obtained over-9dB with the thickness of 2mm and the EAB below-7 dB reaches 4.12 GHz with a thickness of 2.2 mm. The mechanisms of mechanical, microwave absorption and penitential applications for SiC f /SiC composites are also discussed.
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