Improvement of Ge MOS Electrical and Interfacial Characteristics by using NdAlON as Interfacial Passivation Layer

Effect of BN or B4C content on physical and tribological properties of copper‐clad laminates reinforced with carbon fiber and epoxy resin

“…When the BN content is 0.9%, the Dk, peel strength, oxygen index, and arc resistance of the prepared copper‐clad laminates are 19.52 GHz, 2.57 N/mm, 38%, and 160 KV, respectively. When the BN content increases, it initially enhances the properties of the copper‐clad laminate, leading to an increase in Dk value, peel strength, oxygen index, and arc resistance 28 . As the BN content further increases beyond a certain point (0.9%), it starts to have a negative impact, causing a decrease in these properties.…”