2019
DOI: 10.21122/1683-6065-2018-4-38-44
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Improvement of efficiency of use of liquid-glass mixtures. Part 4. Combined strengthening

Abstract: Technological methods applied for intensification liquid-glass mixture hardening process are described. Influence of physical and chemical processes at liquid-glass mixtures technological properties are examined. The application of combined methods of hardening the mixture is proposed, as well as examples of such technological processes are given. The effect of combined methods on the technological properties of the mixture is described. The need for more hard research in this area is justified

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Cited by 6 publications
(3 citation statements)
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“…At the same time, SSS could be solidified by polycondensation mechanism with new solid astringent chemical compounds formation in it or by coagulation mechanism as dehydration result (as dehydration result or certain organic compounds using), its pH value de creasing, silicate modulus increasing, etc. [17].…”
mentioning
confidence: 99%
“…At the same time, SSS could be solidified by polycondensation mechanism with new solid astringent chemical compounds formation in it or by coagulation mechanism as dehydration result (as dehydration result or certain organic compounds using), its pH value de creasing, silicate modulus increasing, etc. [17].…”
mentioning
confidence: 99%
“…Cooling of such castings starts from the outside during solidification under normal conditions. The temperature of the inside layers exceeds the temperature of the surface layers in this process [2]. After reaching the ambient temperature, the surface layers stop shortening due to a decrease in temperature.…”
Section: Review Of Well-known Publications and Researchesmentioning
confidence: 96%
“…However, many researchers who have examined this problem confirmed the facts of presence of substantial deficiencies for these setting mechanisms [7][8][9][10]. So, the process of silica gel forming as a result of a known chemical reaction of waterglass blowing by carbon dioxide via CO 2 process is characterized by low conduction rate in the normal temperature conditions.…”
Section: Introductionmentioning
confidence: 99%