Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials

Kotani, Masahiro; Oh‐e, Masahito; Motobe, Takeharu; Nakamura, Yuki; Konno, Toshio; Minegishi, Tomonori; Ono, Keishi

doi:10.2494/photopolymer.23.477

Cited by 2 publications

(1 citation statement)

References 15 publications

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“…Because of their excellent physical properties, i.e., their mechanical strength, 1,2) electrical properties, 3,4) and chemical resistance, 5) etc., plus their geometrical qualities, functional thin polymer films have been widely used in many applications. It is well known that thin polymer films suffer environmental degradation in practical situations, and thus, monitoring this degradation is very much needed in order to ensure their reliability.…”

Section: Introductionmentioning

confidence: 99%

Monitoring the thermal oxidation of thin polymer films by means of acoustic resonant spectroscopy

Sakamoto¹,

Tohmyoh²

2014

Jpn. J. Appl. Phys.

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This paper describes the use of acoustic resonant spectroscopy to monitor the thermal oxidation of a thin polymer film. The samples were linear low-density polyethylene films with thicknesses of 11.6 µm. These were heat treated at temperatures ranging from 80 to 100 °C in a furnace with an air ambient for a maximum of 10 h. Although no obvious difference between the optical microscope images of the films with and without heating were found, the sound velocity and density, which were measured using acoustic resonant spectroscopy, clearly changed depending on the heat treatment temperature and time. These changes in the acoustic properties were confirmed to be due to thermal oxidation of the films and to correlate with the growth of the oxide which depends on the temperature and time of the heat treatment.

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Section: Introductionmentioning

confidence: 99%

Monitoring the thermal oxidation of thin polymer films by means of acoustic resonant spectroscopy

Sakamoto¹,

Tohmyoh²

2014

Jpn. J. Appl. Phys.

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Latest Technology of Stress Buffer Material for Semiconductor Application

Katoh

2012

Journal of the Society of Rubber Industry, Japan

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Because polyimide (PI) / polybenzoxazole (PBO) materials make semiconductor reliability drastically improved, they have been applied to stress buffer layer for over 30 years. Their purpose used to prevent IC chip from mechanical attack by molding compound filler. In recent years, PI / PBO are required to perform stress relief. In addition to this, they have come to be used as dielectric layer for Cu redistribution layer application as semiconductor package type changes. Therefore, various properties and balanced performances are necessary for PI / PBO materials. This paper reviews latest PI / PBO technologies in semiconductor application.

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Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials

Cited by 2 publications

References 15 publications

Monitoring the thermal oxidation of thin polymer films by means of acoustic resonant spectroscopy

Monitoring the thermal oxidation of thin polymer films by means of acoustic resonant spectroscopy

Latest Technology of Stress Buffer Material for Semiconductor Application

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