Improved thermal conductivity of high‐density polyethylene by incorporating hybrid fillers of copper powders and silicon carbide whiskers
Gengchen Yang,
Yao Li,
Mei Liang
et al.
Abstract:In this paper, highly electrically and thermally conductive copper powders (Cu) and electrically insulative yet thermally conductive silicon carbide whiskers (SiCw) were selected as functional fillers and high‐density polyethylene (HDPE) was used as the matrix to prepare thermal conductive composites. By controlling the amount of Cu at 30 vol% which is below percolation threshold, the volume resistivity of the composites is maintained above 1014 Ω cm. The results showed that SiCws entered the area which was no… Show more
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