“…The attained low contact resistivity is also owing to both chemical and field-effect mechanisms, which can be construed as follows: (i) Chemical passivation screens the dangling bonds and trap states at the interface hindering Fermi-level pinning, even in the absence of LiF x interlayer. (ii) It is well-known that TiO x with a higher concentration of Ov yields higher conductivity and thus lower ρ c . ,,, The overlaying metal can affect the TiO x composition, which indeed depends on the metal work function. , The redox reaction of TiO x enhances when it comes in contact with a low WF overlayer, leading to a reduction in ρ c . ,, (iii) Meanwhile, as probed by AFM (Figure S4b), longer annealing time coincides with the development of valleys or pinholes, which, first, promotes current flow through defect-assisted tunneling and, second, facilitates LiF x diffusion in the TiO x underlay, evoking energy states close to the conduction and/or valence bands of TiO x and thus exciting its conductivity . Because of the aforementioned reasons, we observed a lower ρ c as LiF x and/or a longer annealing duration was employed (see Figure c).…”