2023
DOI: 10.1016/j.msea.2023.144910
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Improved microstructure, mechanical properties and electrical conductivity of the Cu–Ni–Sn–Ti–Cr alloy due to Ce micro-addition

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Cited by 20 publications
(2 citation statements)
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“…Spacing planes of 0.212 nm and 0.206 nm were measured by calibrating the FFT images, respectively. The mismatch between the enriched Cr particle and matrix can be calculated using the following formula [ 28 ]: where d matrix and d particle are the crystal plane spacing. The mismatch is less than 5%.…”
Section: Resultsmentioning
confidence: 99%
“…Spacing planes of 0.212 nm and 0.206 nm were measured by calibrating the FFT images, respectively. The mismatch between the enriched Cr particle and matrix can be calculated using the following formula [ 28 ]: where d matrix and d particle are the crystal plane spacing. The mismatch is less than 5%.…”
Section: Resultsmentioning
confidence: 99%
“…The potential outcomes of this groundbreaking endeavor are transformative. By enhancing the mechanical properties and wear resistance of CuNiSi alloys, we anticipate meeting significant industrial demands while expanding the horizons of CuNiSi alloy applications [14][15][16][17]. This research endeavor is not just a study in materials science; it represents a leap forward in the engineering world, with the promise of unlocking novel solutions and capabilities across multiple sectors.…”
Section: Research Articlementioning
confidence: 99%