Improved Low Temperature Sinter Bonding Using Silver Nanocube Superlattices

Bronchy, Maxime; Roach, Lucien; Mendizabal, L.; Feautrier, Céline; Durand, Etienne; Heintz, Jean‐Marc; Duguet, Étienne; Tréguer‐Delapierre, Mona

doi:10.1021/acs.jpcc.1c09125

Cited by 6 publications

(12 citation statements)

References 41 publications

(73 reference statements)

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“…40 Specifically, two different temperatures were selected for this study: 300, and 450 °C, with an equal dwelling time of 60 min. 41…”

Section: Resultsmentioning

confidence: 99%

“…By thermally decomposing the coating shell, the surface energy of the nanoparticles will increase, allowing the more energized surface atoms to rearrange even below the nanoparticle melting point. [41][42][43] This effect combined with the short interparticle distance inside the clusters (o2 nm), induces the coalescence of the 50 nm colloids into a single plasmonic unit. This would eliminate the near-field coupling existing within the clusters, reducing the optical losses within the system and yielding sharper LPRs.…”

Section: Post-assembly Modifications: Thermal Annealingmentioning

confidence: 99%

“…40 Specifically, two different temperatures were selected for this study: 300, and 450 1C, with an equal dwelling time of 60 min. 41 During the annealing procedure, two different effects have to be taken into consideration. The first is the elimination of the organic ligand surrounding (and stabilizing) the individual nanoparticles composing the clusters.…”

Section: Post-assembly Modifications: Thermal Annealingmentioning

confidence: 99%

“…[55][56][57][58][59] These effects were recently studied by Bronchy et al for the sintering of silver nanocubes. 41 In this study, we decided to maintain the RTA profile consistent for all the samples, in order to identify potential advantages in the use of mixture colloids for the preparation of annealed plasmonic arrays.…”

Section: Post-assembly Modifications: Thermal Annealingmentioning

confidence: 99%

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Pre- and post-assembly modifications of colloidal plasmonic arrays: the effect of size distribution, composition and annealing

et al. 2022

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“…40 Specifically, two different temperatures were selected for this study: 300, and 450 °C, with an equal dwelling time of 60 min. 41…”

Section: Resultsmentioning

confidence: 99%

Section: Post-assembly Modifications: Thermal Annealingmentioning

confidence: 99%

Section: Post-assembly Modifications: Thermal Annealingmentioning

confidence: 99%

Section: Post-assembly Modifications: Thermal Annealingmentioning

confidence: 99%

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Pre- and post-assembly modifications of colloidal plasmonic arrays: the effect of size distribution, composition and annealing

et al. 2022

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“…Although a simultaneous sintering and joining methodology was reported previously, − employing an interface eutectic reaction and incipient melting between Al and Si was not reported so far, to the best of our knowledge. Here, we propose a simultaneous sintering of Al–Si and joining with a solid substrate (alumina or Al alloy) utilizing incipient eutectic melting at the Al–Si particulate interface.…”

Section: Introductionmentioning

confidence: 90%

On Simultaneous Sintering and Joining by Electric Current Activated Interfacial Eutectic Melting of Al–Si for Electronic Packaging Applications

Thiagarajan

Kamaraj

Jayapalan

et al. 2022

ACS Appl. Eng. Mater.

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Worldwide, exponential growth in energy consumption demands energy efficient and innovative material synthesis techniques. Conventional material joining processes for electronic applications such as brazing and soldering have limitations due to chemically distinct interface materials and multiple step processing. In this work, we have demonstrated a single step metal−ceramic joining and a single step metal−metal joining, without any interface material, using electric current activated eutectic melting during spark plasma sintering. Particulates of hypereutectic Al−Si, a potential candidate for electronic packaging of high-power density electronic components, were sintered and simultaneously joined with a solid alumina substrate. Similarly, hypereutectic Al−Si particulates were sintered and joined with solid aluminum alloy AA6061 as well. The selective interfacial eutectic melting between Al and Si, due to the resistance offered to electric current, aids in simultaneous joining with solid substrates apart from aiding in densification of particulate aggregates. The Al−Si regions at joint interfaces are characterized by finer eutectic silicon formation. The interlaminar shear strengths (ILSS) of Al−Si/AA6061 joints were nearly 3-fold (≈110 MPa) higher than that of Al−Si/Al 2 O 3 joints due to the nature bonding. The absence of a chemically distinct interfacial layer and existence of finer microstructure at the joint interface resulted in excellent structural integrity. Our work paves the way for employing electric current assisted eutectic melting to create metal−ceramic and metal−metal joints.

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Comparative Study on Thermal and Laser Sintering of Silver Nanocubes and Silver Nanoplates

Zhang

Liu

2023

Physica Status Solidi (a)

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Compared with silver nanowires and silver nanospheres, silver nanocubes and silver nanoplates with larger curvature structures like sharp vertices and edges have great potential in optical applications. In general, the controllable joining of silver nanomaterials has become an effective way to change the electrical and optical properties of silver nanomaterials in recent years. However, urgent research on the controllable joining of silver nanocubes or silver nanocubes is still rarely reported. After being thermal treated at 250 °C for 8 min, a good joining among silver nanocubes can be obtained without significant damage to the cubic structure. For laser sintering, with the increase of laser energy input, silver nanocubes gradually transformed to spherical particles. Joining among few particles can be observed when silver nanocubes were scanned by 5 W of laser at 1.0 mm s‐1. Obvious joining among silver nanocubes can be obtained by thermal treating at 300 °C for 5 min and laser scanning at 7 W at 0.2 mm s‐1. Thermal heating is more suitable for forming different degrees of connection between silver nanocubes or between silver nanocubes, while laser treatment is suitable for changing the shape of silver nanocubes or silver nanocubes without obvious connection.This article is protected by copyright. All rights reserved.

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Improved Low Temperature Sinter Bonding Using Silver Nanocube Superlattices

Cited by 6 publications

References 41 publications

Pre- and post-assembly modifications of colloidal plasmonic arrays: the effect of size distribution, composition and annealing

Pre- and post-assembly modifications of colloidal plasmonic arrays: the effect of size distribution, composition and annealing

On Simultaneous Sintering and Joining by Electric Current Activated Interfacial Eutectic Melting of Al–Si for Electronic Packaging Applications

Comparative Study on Thermal and Laser Sintering of Silver Nanocubes and Silver Nanoplates

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