“…Polymer composites with substantially improved thermal conductivity ( k ) [ 1 , 2 , 3 ] and dielectric permittivity ( ε ) [ 4 ] are in great need for many applications, such as thermal interface materials [ 5 , 6 ], heat dissipation and thermal management [ 7 , 8 , 9 ], microelectronics, and energy storage related applications [ 4 , 10 , 11 , 12 ]. Appropriate fillers with inherent high performance are essential for preparing these desired functional polymer composites.…”