2013
DOI: 10.12693/aphyspola.124.231
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Improved Czochralski Growth of Germanium Single Crystals from a Melt Covered by Boron Oxide

Abstract: In germanium (Ge) crystal growth, a serious problem in growing high quality Ge crystals is the formation of germanium-oxide-particles on the melt surface. In addition, B doping in Ge crystals is very dicult because of the segregation coecient, which is greater than unity, and the instability of free B atoms in the Ge melt. We have found a unique solution, which is CZ-Ge crystal growth from a melt covered by boron oxide (B2O3). Ge crystals which are dislocation-free and/or oxygen-enriched can be grown by these … Show more

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Cited by 3 publications
(2 citation statements)
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“…2,3 A frequently used technique for growing larger single crystals is the Czochralski or Crystal Pulling method, including many improvements on the original method. 4 Additionally, crystals can be formed by repeatedly depositing thin layers onto a crystalline seed layer with a well-dened orientation, and this method is called epitaxy, although it is mainly used for semiconductor crystal growth, and thus less for X-ray diffracting crystals. 5,6 A more recent generation of optics is made out of pyrolytic graphite, for example highly annealed pyrolytic graphite (HAPG) or highly oriented pyrolytic graphite (HOPG).…”
Section: Introductionmentioning
confidence: 99%
“…2,3 A frequently used technique for growing larger single crystals is the Czochralski or Crystal Pulling method, including many improvements on the original method. 4 Additionally, crystals can be formed by repeatedly depositing thin layers onto a crystalline seed layer with a well-dened orientation, and this method is called epitaxy, although it is mainly used for semiconductor crystal growth, and thus less for X-ray diffracting crystals. 5,6 A more recent generation of optics is made out of pyrolytic graphite, for example highly annealed pyrolytic graphite (HAPG) or highly oriented pyrolytic graphite (HOPG).…”
Section: Introductionmentioning
confidence: 99%
“…In view of this situation, an investigation has been carried out to understand a relationship between the bond force and the die crack at Germanium (Ge) substrate of AlInGaP die. This Ge substrate used in the AlInGaP die, is a single crystal Ge, having face-centre-cubic (FCC) diamond-type lattice with (111) plane [12,13]. It is brittle at room temperature and it has been commonly used as a substrate in the Opto semiconductor industry for long time due to several advantages over Gallium Arsenide (GaAs).…”
Section: Introductionmentioning
confidence: 99%