Improved coefficient thermal expansion and mechanical properties of PTFE composites for high-frequency communication

Enhancing the dielectric and thermal properties of polytetrafluoroethylene-based composites through designing and constructing a novel interfacial structure

“…However, for the same filler content, the tan δ of mSiO 2 /PTFE is significantly lower than that of sSiO 2 /PTFE, ranging from 1.85 × 10 −3 to 2.71 × 10 −3 at 30 GHz. The reason for the decrease in tan δ is as follows: The presence of more polar bonds (Si– O –Si and H– O –H) at the SiO 2 solid-gas interface provides additional polarization loss by the formation of locally aligned dipoles when SiO 2 interfaces poorly with PTFE, whereas mSiO 2 /PTFE has a tight interfacial combination, which decreases the polarization loss [ 38 ].…”

“…PTFE-based composites, which are used as core component materials, can cause electronic devices to fail if the CTE is too high [ 38 , [39] , [40] ]. Therefore, PTFE-based composites with low CTE while maintaining low ε r and low tan δ are essential to ensure the application of composites.…”

Carbon nitride/polyimide porous film via an NIPS method with advanced dielectric and hydrophobicity properties

“…These devices are the most cost-effective way to minimize crosstalk, solve signal transmission delay, and promote the development of high-frequency devices and communication modules. [1][2][3][4] High-performance insulating polymer materials, such as polyimide (PI), have attracted wide attention in the microelectronics industry, due to its outstanding mechanical properties, high breakdown strength, excellent thermal stability and low moisture absorption. [5][6][7][8] Nevertheless, the relatively high dielectric constant of PI (3 0 ∼3.3-3.5) restricts its further application as a dielectric layer material in "high-speed" integrated circuits.…”

Fluorinated Polydopamine Shell Decorated Fillers in Polytetrafluoroethylene Composite for Achieving Highly Reduced Coefficient of Thermal Expansion

“…The incorporation of ceramic fillers with low CTEs is the most frequently used strategy to achieve the goal of CTE reduction in PTFE coating [4,5]. However, the severe aggregation of fillers and poor interfacial interactions between fillers and PTFE are the two main challenges for the PTFE composites due to the ultra-low surface energy of PTFE [6].…”