Improved barrier and mechanical properties of Al2O3/acrylic laminates using rugged fluorocarbon layers for flexible encapsulation

Chen, Guixiong; Weng, Yalian; Sun, Fan; Hong, Deming; Zhou, Xiongtu; Guo, Tailiang; Zhang, Yongai; Yan, Qun; Wu, Chaoxing; Sun, Lei

doi:10.1016/j.orgel.2021.106263

Cited by 10 publications

(13 citation statements)

References 44 publications

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“….9 eV (OCO), which correspond to the expected peak positions of polymethymelthacrylate. 9 The proportions of these peaks were 59.6%, 35.2%, 4.2%, and 1.0%, respectively. This indicates that the polymerization process leads to a significant presence of C−C bonds, whereas the proportion of OCO bonds is very low (∼1%), which is also consistent with the FTIR results.…”

Section: Resultsmentioning

confidence: 93%

“…The peak deconvolution of O 1s peak leads to peaks at 532.4 eV (OC) and 533.1 eV (O−C), and the portion of the peaks were found to be 53.6% and 46.4%. 9 We evaluated the optical, structural, and water vapor permeation properties of organic/inorganic hybrid TFE layers. The 1.5 dyad TFE composed of Al 2 O 3 /polymer/Al 2 O 3 was selected as the final structure.…”

Section: Resultsmentioning

confidence: 99%

“…1 However, studies on organic/ inorganic hybrid TFEs fabricated using the IJP that can be applied to the industrial world are lacking. 1,9 The PECVD process is an inorganic film deposition method often used in industry owing to the advantages of in situ cleaning and fast tact time. However, inorganic thin films produced through this process suffer from several disadvantages such as excessive thickness, large surface roughness, low transmittance, and the Mura phenomenon, limiting their application in various display panels.…”

Section: Introductionmentioning

confidence: 99%

“…The organic layer also covers particles on the inorganic surface formed by the inorganic thin film deposition process to create a smooth and flat surface; thus aiding the formation of uniform inorganic thin films with high-quality upper layers . However, studies on organic/inorganic hybrid TFEs fabricated using the IJP that can be applied to the industrial world are lacking. , …”

Section: Introductionmentioning

confidence: 99%

“…The PECVD process is an inorganic film deposition method often used in industry owing to the advantages of in situ cleaning and fast tact time. However, inorganic thin films produced through this process suffer from several disadvantages such as excessive thickness, large surface roughness, low transmittance, and the Mura phenomenon, limiting their application in various display panels. − To overcome these drawbacks, atomic layer deposition (ALD) has been actively studied as an alternative fabrication process. ,,− The primary advantage of ALD is that it is potentially applicable to future devices that utilize deformable and stretchable materials because ALD can be used to fabricate films that provide excellent protection from moisture and oxygen with a very thin Al 2 O 3 film (≤40 nm). − Other important requirements of effective moisture and oxygen barriers for flexible devices are the coverage ability for defects and particles, low heat treatment temperature, high transparency, and low surface roughness. ALD is an inorganic deposition method that can be used to fabricate barriers with the required properties.…”

Section: Introductionmentioning

confidence: 99%

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Organic/Inorganic Hybrid Thin-Film Encapsulation Using Inkjet Printing and PEALD for Industrial Large-Area Process Suitability and Flexible OLED Application

Kwon

Joo

Cho

et al. 2021

ACS Appl. Mater. Interfaces

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We present herein the first report of organic/ inorganic hybrid thin-film encapsulation (TFE) developed as an encapsulation process for mass production in the display industry. The proposed method was applied to fabricate a top-emitting organic light-emitting device (TEOLED). The organic/inorganic hybrid TFE has a 1.5 dyad structure and was fabricated using plasma-enhanced atomic layer deposition (PEALD) and inkjet printing (IJP) processes that can be applied to mass production operations in the industry. Currently, industries use inorganic thin films such as SiN x and SiO x N y fabricated through plasma-enhanced chemical vapor deposition (PECVD), which results in film thickness >1 μm; however, in the present work, an Al 2 O 3 inorganic thin film with a thickness of 30 nm was successfully fabricated using ALD. Furthermore, to decouple the crack propagation between the adjacent Al 2 O 3 thin films, an acrylate-based polymer layer was printed between these layers using IJP to finally obtain the 1.5 dyad hybrid TFE. The proposed method can be applied to optoelectronic devices with various form factors such as rollables and stretchable displays. The hybrid TFE developed in this study has a transmittance of 95% or more in the entire visible light region and a very low surface roughness of less than 1 nm. In addition, the measurement of water vapor transmission rate (WVTR) using commercial MOCON equipment yielded a value of 5 × 10 −5 gm −2 day −1 (37.8 °C and 100% RH) or less, approaching the limit of the measuring equipment. The TFE was applied to TEOLEDs and the improvement in optical properties of the device was demonstrated. The OLED panel was manufactured and operated stably, showing excellent consistency even in the actual display manufacturing process. The panel operated normally even after 363 days in air. The proposed organic/inorganic hybrid encapsulant manufacturing process is applicable to the display industry and this study provides basic guidelines that can serve as a foothold for the development of various technologies in academia and industry alike.

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Section: Resultsmentioning

confidence: 93%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Organic/Inorganic Hybrid Thin-Film Encapsulation Using Inkjet Printing and PEALD for Industrial Large-Area Process Suitability and Flexible OLED Application

Kwon

Joo

Cho

et al. 2021

ACS Appl. Mater. Interfaces

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Layer‐Engineered Functional Multilayer Thin‐Film Structures and Interfaces through Atomic and Molecular Layer Deposition

Heikkinen,

Ghiyasi,

Karppinen

2024

Adv Materials Inter

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Atomic layer deposition (ALD) technology is one of the cornerstones of the modern microelectronics industry, where it is exploited in the fabrication of high‐quality inorganic thin films with excellent precision for film thickness and conformality. Molecular layer deposition (MLD) is a counterpart of ALD for purely organic thin films. Both ALD and MLD rely on self‐limiting gas‐surface reactions of vaporized and sequentially pulsed precursors and are thus modular, meaning that different precursor pulsing cycles can be combined in an arbitrary manner for the growth of elaborated superstructures. This allows the fusion of different building blocks — either inorganic or organic — even with contradicting properties into a single thin‐film material, to realize unforeseen material functions which can ultimately lead to novel application areas. Most importantly, many of these precisely layer‐engineered materials with attractive interfacial properties are inaccessible to other synthesis/fabrication routes. In this review, the intention is to present the current state of research in the field by i) summarizing the ALD and MLD processes so far developed for the multilayer thin films, ii) highlighting the most intriguing material properties and potential application areas of these unique layer‐engineered materials, and iii) outlining the future perspectives for this approach.

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P‐7.2: Study on the cone‐jet mode spraying mechanism of electrohydrodynamic atomization printing for OLED organic thin‐film encapsulation

Hu,

Pan,

et al. 2024

Symp Digest of Tech Papers

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As the hottest display technology today, OLED devices have been widely used in mobile devices, flexible displays, and other fields. Encapsulation layer film as a protective layer for OLED devices, its current manufacturing technology faces great challenges. The main reason for the challenges is the high cost and low efficiency of current manufacturing technologies. Electrohydrodynamic atomization printing (EHDAP), a low‐cost technology for the rapid manufacture of large‐area films, is up and coming for OLED encapsulation film manufacturing. In this paper, the manufacturing process of EHDAP is investigated for organic layer encapsulation film manufacturing. Multiple spray modes of organic layer encapsulated film solutions were investigated. The effect of printing states in different modes on fabricating organic layer encapsulated films was analyzed. The process phase diagram intervals are given for determining the boundaries of the steady injection state. Further production of organic layer encapsulation film with 95.7% uniformity based on self‐developed printing equipment. The theoretical and experimental studies in this paper pave the way for further development of EHDAP in OLED displays.

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Improved barrier and mechanical properties of Al2O3/acrylic laminates using rugged fluorocarbon layers for flexible encapsulation

Cited by 10 publications

References 44 publications

Organic/Inorganic Hybrid Thin-Film Encapsulation Using Inkjet Printing and PEALD for Industrial Large-Area Process Suitability and Flexible OLED Application

Organic/Inorganic Hybrid Thin-Film Encapsulation Using Inkjet Printing and PEALD for Industrial Large-Area Process Suitability and Flexible OLED Application

Layer‐Engineered Functional Multilayer Thin‐Film Structures and Interfaces through Atomic and Molecular Layer Deposition

P‐7.2: Study on the cone‐jet mode spraying mechanism of electrohydrodynamic atomization printing for OLED organic thin‐film encapsulation

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