“…With the increasingly severe service conditions of microdevices, the requirements for the performance of the thin-film materials have gradually increased, leading to extensive applications such as nonenzyme glucose sensors [1], highstrength and high-conductivity films [2], antibacterial films [3], semiconductor interconnect [4], wear-resistant films [5], packaging film materials [6] and so on. There are many methods to prepare thin films, such as electrical deposition [7], arc evaporation [8], wet-laid and spunlace process [9], arc discharge [10] and son on [11], but these methods are not suitable for preparing low solid solubility alloy films.…”