Implementation of an Automatic Optical Inspection System for Solder Quality Classification of THT Solder Joints

Fonseka, C. L. S. C.; Jayasinghe, J.A.K.S.

doi:10.1109/tcpmt.2018.2864666

Cited by 44 publications

(24 citation statements)

References 12 publications

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“…Where most of the researcher focused on inspecting SMT solder joints, Fonseka et al in [148] inspected through hole technology (THT) solder joints. In contrast to SMT, the bulkier packages of THT components have a higher positioning tolerance and are soldered from the other side of the PCB.…”

Section: Pcb Defectsmentioning

confidence: 99%

“…Three of these studies [150]- [152] were focusing on extracting the features and creating color models for pad and solder joint detection. While the fourth study [148] was a continuation approach that focused on automatic solder quality classification for solder bridging, voids in drillhole region, voids on pad region, and excess solder on solder joint. According to them, THT solder joint inspection must be carried out within 6 seconds to meet the manufacturing requirements.…”

Section: Pcb Defectsmentioning

confidence: 99%

See 1 more Smart Citation

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

2020

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Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, microelectronics , and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.

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Section: Pcb Defectsmentioning

confidence: 99%

Section: Pcb Defectsmentioning

confidence: 99%

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

2020

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“…Vikas et al 33 proposed a referential method to detect and classify the defects of PCB into all possible 14 classes using image registration and image segmentation methods. Fonseka et al 6 presented an automatic vision system that is capable of classifying four major types of soldering defects inside a solder joint in order to assess the quality of solder joints.…”

Section: Related Workmentioning

confidence: 99%

“…Although these methods can be e®ective at locating solder joints, but only if welding them one by one, they cannot meet the requirements of locating the solder joints of the entire image at the same time and still have a high precision. 2,[5][6][7]9,10,[15][16][17][19][20][21]24,[33][34][35][36][37][38][39][40] Combined with the characteristics of the small PCB size, the large number of solder joints, the small single spot area and the compressed welded, the traditional methods mentioned classify and locate the solder joints one by one so that they are not suitable for the extraction of various solder joints. 3,14,26,28,30,32 Compared with existing works on PCB solder joint extraction and inspection, the novelty and advantages from this paper are as follows:…”

Section: Related Workmentioning

confidence: 99%

A Novel Multi-Pattern Solder Joint Simultaneous Segmentation Algorithm for PCB Selective Packaging Systems

Huang

Shen

Xie

et al. 2019

Int. J. Patt. Recogn. Artif. Intell.

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To prevent any negative electromagnetic influence of high-density integrated circuits, an insulation package needs to be specially designed to shield it. Aiming at the low efficiency and material waste in traditional packaging methods, a printed circuit board (PCB) selective packaging system based on a multi-pattern solder joint simultaneous segmentation algorithm and three-dimensional printing technology is introduced in this paper. Firstly, the structure of PCB selective packaging system is designed. Secondly, to solve the existing problems, such as multi-pattern solder joints which are located densely in small welding areas and are hard to be extracted in the small-area integrated circuit board, a multi-pattern solder joint simultaneous segmentation algorithm is developed based on (geometrical) neighborhood features to extract and locate the optimal PCB solder joint areas. Finally, tests using three actual PCB are carried out to compare the proposed method with traditional multi-threshold solder joint extraction methods. Test results indicate that the proposed algorithm is simple and effective. Diverse solder joints can be optimally located and simultaneously extracted from the collected PCB image, which greatly improves the filling rate of the solder joint areas and filters out false pixels. Thus, this method provides a reliable location-finding tool to help place solder points in PCB selective packaging systems.

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“…In recent years, many scholars have conducted in-depth studies on the stability and efficiency of these two methods. In the application of AOI based on image, [4] have presented a detailed explanation on a set of novel algorithms that can be effectively used to implement an automatic vision system which is capable of classifying the quality of Through Hole Technology (THT) solder joints very precisely and the system has an improved recognition rate and good resilience. A highresolution AOI system based on parallel computing is developed in [5] to achieve fast inspection and classification of surface defects.…”

Section: Introductionmentioning

confidence: 99%

Repair Method of Data Loss in Weld Surface Defect Detection Based on Light Intensity and 3D Geometry

Shiyi

Xing

2020

IEEE Access

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Weld surface quality inspection is an indispensable part in the welding automation engineering. When Laser Triangulation Method (LTM) is used to scan the weld surface, external factors will interfere with the laser center line, resulting in data loss and quality detection failure, and massive data loss is difficult to be repaired in the traditional way. In order to improve the quality of weld surface defect detection, it is necessary to find an effective and strong anti-interference method to fix the lost data. This paper presents a method of fixing the data loss caused by external environmental factors in the process of detecting flatbed lap weld surface defects by LTM. The paper includes the analysis of the causes of data loss, its impact for practical applications and a repair method. The repair method derives a formula which is suitable for expressing three-dimensional points on weld surface by combining Bidirectional Reflectance Distribution Function (BRDF) and weld surface section model. The accuracy of the algorithm is verified by experiments on standard block and single weld cross-section. The accuracy of the method up to 92% and the repair rate improved by 30%. The method was tested on flatbed lap weld to confirm its effectiveness in the field of catching surface defects hidden in the lost data.

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Implementation of an Automatic Optical Inspection System for Solder Quality Classification of THT Solder Joints

Cited by 44 publications

References 12 publications

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

A Novel Multi-Pattern Solder Joint Simultaneous Segmentation Algorithm for PCB Selective Packaging Systems

Repair Method of Data Loss in Weld Surface Defect Detection Based on Light Intensity and 3D Geometry

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