Implementation of a new thermal path within the structure of inorganic encapsulated power modules

Behrendt, S.; Eisele, R.; Scheibel, M.G.; Kaessner, S.

doi:10.1016/j.microrel.2019.113430

Cited by 4 publications

(1 citation statement)

References 2 publications

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“…However, since conventional encapsulation materials have low thermal conductivity, inorganic materials such as ceramics are being investigated [54]. Ceramic encapsulants were shown to increase the power module's lifetime by a factor of 3.5.…”

Section: E Encapsulation Materialsmentioning

confidence: 99%

Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies. INDEX TERMS Electric vehicles, power electronics, semiconductor device packaging TABLE I PRIMARY DESIGN CONSIDERATIONS OF MODULE PACKAGING Design considerations Details Size Volume, weight, power density, energy density. Electrical performance Current rating, voltage rating, switching frequency range, power loss, electrical insulation, electromagnetic interference (EMI). Thermal management Temperature distribution, thermal resistance (Rth), heat capacity, coefficient of thermal expansion (CTE). Mechanical strength Thermal stress distribution, material properties (Tensile strength, flexural strength, peel strength, etc.), external shock and vibration. Reliability and fatigue Joints failure, crack propagation, delamination, lifetime under temperature and power cycling. Manufacturability and assembly Manufacture procedure, process temperature and pressure, external connections.

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Section: E Encapsulation Materialsmentioning

confidence: 99%