2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407)
DOI: 10.1109/vlsit.2003.1221117
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Impacts of high modulus ultra low-k/Cu 300 mm-wafer integration for 65 nm technology node and beyond

S. Sone1,
N. Ohashi2,
Hee Jun Shin3
et al.
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