Impact Strength Evaluation of Solder Joints in BGA by Dropping Steel Rod

A novel impact test system for more efficient reliability testing

“…However, the strains and stresses produced in the bumps differ from those experienced by the soldered interconnections in real operating environments and, therefore, the failure modes that are produced are very probably different. Other types of impact test methods include the board-level impact bending test, which involves dropping an impact weight onto a component board [5,6]. These tests, however, create a highly localised deformation of the component boards and do not produce the gradually decaying 0026-2714/$ -see front matter Ó 2010 Elsevier Ltd. All rights reserved.…”