Impact of thermal stress on the characteristics of conducted emissions

Montanari, I.; Tacchini, Alessandro; Maini, M.

doi:10.1109/isemc.2008.4652103

Cited by 13 publications

(9 citation statements)

References 2 publications

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“…Figure 1 presents the methodology used to extract EMC level drifts induced by ageing as accurately as possible [4]. , thermal cycling or electrical overstress induce a significant variation of electromagnetic behaviour [5]. In the following experimental studies, HTOL, LTOL and electrical stress have been selected to accelerate electrical degradation mechanisms.…”

Section: Emr Methodologymentioning

confidence: 99%

Electro-magnetic robustness of integrated circuits: from statement to prediction

Dhia

Boyer

2013

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

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EMRIC project, a new research activity mixing integrated circuits electromagnetic compatibility (EMC) and integrated circuits (ICs) reliability, provides methods and guidelines to circuits and equipment designers to ensure EMC during lifetime of their applications. In order to improve the ICs electromagnetic robustness (EMR) this project studies the effect of ICs ageing on electromagnetic emission and immunity to radio frequency interferences, clarifies the link between IC degradations and related EMC drifts and develops prediction models and propose "time insensitive" EMC protection structures.

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Section: Emr Methodologymentioning

confidence: 99%

Electro-magnetic robustness of integrated circuits: from statement to prediction

Dhia

Boyer

2013

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

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“…The drift of the electrical characteristics of semiconductor devices can have direct consequences on integrated circuit electromagnetic emission (EME) and power integrity (PI). Recently, some publications have shown that accelerated aging tests such as high or low temperature operating life, thermal cycling, or electrical overstress induce a significant variation of EME produced by power supply units [4], high side switch devices [5] or I/O buffers [6]. However, these studies do not clarify the origins of EME changes and do not address modeling and prediction issues.…”

Section: Introductionmentioning

confidence: 97%

Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emission

Boyer

Dhia

2013

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

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International audienceRecent studies have shown that integrated circuit aging modifies electromagnetic emission significantly. The proposed paper aims at evaluating the impact of aging on the power integrity and the conducted emission of digital integrated circuits, clarifying the origin of electromagnetic emission evolution and proposing a methodology to predict this evolution. On-chip measurements of power supply voltage bounces in a CMOS 90 nm technology test chip and conducted emission measurements are combined with electric stress to characterize the influence of aging. Simulations based on ICEM modeling modified by an empirical coefficient to model the evolution of the emission induced by device aging is proposed and tested

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“…The management of both constraints constitutes a serious challenge for electronic industry to ensure a reliable operation of digital circuits and comply with electromagnetic compatibility (EMC) requirements. Recently, some publications have shown experimentally that accelerated aging tests such as high or low temperature operating life, thermal cycling, or electrical overstress induce a significant variation of EME produced by power supply units [5], high side switch devices [6] digital circuits or I/O buffers [7]. However, these studies do not clarify the origins of EME changes and do not address the modeling and prediction issues.…”

Section: Introductionmentioning

confidence: 99%

Effect of Aging on Power Integrity and Conducted Emission of Digital Integrated Circuits

Boyer¹,

Dhia²

2014

Journal of Low Power Electronics

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Recent studies have shown that integrated circuit aging modifies electromagnetic emission significantly. The proposed paper aims at evaluating the impact of aging on the power integrity and the conducted emission of digital integrated circuits, clarifying the origin of electromagnetic emission evolution and proposing a methodology to predict this evolution. On-chip measurements of power supply voltage bounces in a CMOS 90 nm technology test chip and conducted emission measurements are combined with electric stress to characterize the influence of aging. Simulations based on ICEM modeling modified by an empirical coefficient to model the evolution of the emission induced by device aging is proposed and tested.

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Impact of thermal stress on the characteristics of conducted emissions

Cited by 13 publications

References 2 publications

Electro-magnetic robustness of integrated circuits: from statement to prediction

Electro-magnetic robustness of integrated circuits: from statement to prediction

Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emission

Effect of Aging on Power Integrity and Conducted Emission of Digital Integrated Circuits

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