2008
DOI: 10.1007/s11664-008-0400-0
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Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

Abstract: The electronic packaging industry uses electroless nickel immersion gold (ENIG) or Cu-organic solderability preservative (Cu-OSP) as a bonding pad surface finish for solder joints. In portable electronic products, drop impact tests induce solder joint failures via the interfacial intermetallic, which is a serious reliability concern. The intermetallic compound (IMC) is subjected to thermal cycling, which negatively affects the drop impact reliability. In this work, the reliability of lead-free Sn-3.0Ag-0.5Cu (… Show more

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Cited by 96 publications
(29 citation statements)
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“…The number of falls that the specimen can withstand before failure is regarded as the lifetime of the specimen. [8][9][10][11][12][13] In the case of an ENIG surface finish, a P-rich Ni layer is formed with a relative increase in the P content in the Ni-P layer according to the reaction between Sn and Ni in the solder after reflow or thermal aging, and it is known that such a P-rich Ni layer is sensitive to external shocks, because of the Kirkendall voids distributed within this layer. 14) Accordingly, in this study, the drop test with or without Pd is performed by jointing a representative lead-free solder consisting of Sn-Ag-Cu on boards with ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface finishes.…”
Section: Introductionmentioning
confidence: 99%
“…The number of falls that the specimen can withstand before failure is regarded as the lifetime of the specimen. [8][9][10][11][12][13] In the case of an ENIG surface finish, a P-rich Ni layer is formed with a relative increase in the P content in the Ni-P layer according to the reaction between Sn and Ni in the solder after reflow or thermal aging, and it is known that such a P-rich Ni layer is sensitive to external shocks, because of the Kirkendall voids distributed within this layer. 14) Accordingly, in this study, the drop test with or without Pd is performed by jointing a representative lead-free solder consisting of Sn-Ag-Cu on boards with ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface finishes.…”
Section: Introductionmentioning
confidence: 99%
“…8 and 9, in accordance with literature reports. 19 Furthermore, statistical analysis of each kind of specimen in the 100 h aged condition showed that there were four Sn-37Pb, three Sn-3.8Ag-0.7Cu, and one Sn-3.8Ag-0.7Cu-RE solder joints that fractured along both interfaces, which remarkably reinforced the impact absorbed energy. In terms of the influence of RE elements on crack propagation, based on stereo microscopy observation, the fractures primarily propagated along one of the interfaces after thermal aging, which caused the impact absorbed energy to be more stable.…”
Section: Observation Of Impact-induced Fracture Surfacementioning
confidence: 95%
“…Compared with the cross-sectional view of raw material shown in Fig. 17(c), these dark lines were groove structured and penetrated into the Ni layer. Several studies have indicated that this symptom was caused by corrosion during the Au plating process (Bulwith et al, 2002;Xu et al, 2008). PCB vendors claim that a Ni layer without this spike symptom is not achievable.…”
Section: Black Padmentioning
confidence: 99%