Impact of the ROHS directive on high-performance electronic systems

Puttlitz, Karl J.; Galyon, G.T.

doi:10.1007/s10854-006-9023-5

Cited by 26 publications

(14 citation statements)

References 14 publications

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“…However, more and more countries and regions have enacted legislation to ban hazardous materials, such as Pb, due to their harmful influence on the environment and human health. 1 In the last decade, a great number of lead-free solders have been reported and investigated. [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21] Among these lead-free solder candidates, the Sn-AgCu (SAC) solders have been considered as replacements for the Pb-containing solders and are increasingly employed for microelectronics applications.…”

Section: Introductionmentioning

confidence: 99%

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Zhu²,

Poh³

et al. 2011

Journal of Elec Materi

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In this work, tensile creep tests for Sn-1.0Ag-0.5Cu-0.02Ni solder have been conducted at various temperatures and stress levels to determine its creep properties. The effects of stress level and temperature on creep strain rate were investigated. Creep constitutive models (such as the simple power-law model, hyperbolic sine model, double power-law model, and exponential model) have been reviewed, and the material constants of each model have been determined based on experimental results. The stress exponent and creep activation energy have been studied and compared with other researchers' results. These four creep constitutive models established in this paper were then implemented into a user-defined subroutine in the ANSYSä finite-element analysis software to investigate the creep behavior of Sn-1.0Ag-0.5Cu-0.02Ni solder joints of thin fine-pitch ball grid array (TFBGA) packages for the purpose of model comparison and application. Similar simulation results of creep strain and creep strain energy density were achieved when using the different creep constitutive models, indicating that the creep models are consistent and accurate.

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Section: Introductionmentioning

confidence: 99%

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Zhu²,

Poh³

et al. 2011

Journal of Elec Materi

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“…However, the traditional eutectic or near eutectic Sn-Pb, Sn-Ag, and Sn-Ag-Cu solders and conductive adhesive used in die attachment are not reliable for high power density and high temperature electronic applications [2][3][4]. The Pb-containing solder alloys (Sn-Pb) have been temporarily exempted from the Restriction of Hazardous Substances (RoHS) directive in the European Union due to serious health threat to human being and heavy pollution to environment [5,6]. On the other hand, it is reported that the joint using Pb-containing solder and Pb-free eutectic or near eutectic Sn-Ag and Sn-Ag-Cu solders is not suitable for long-term usage at elevated temperature due to crack formation at the intermetallic (IMC) layer between the solder and the metallized substrate on the devices [7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Low‐Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

Guo

Zeng

Zhang

et al. 2015

Journal of Nanomaterials

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Ag nanoparticles (NPs) with about 40 nm diameter covered with 5–8 nm organic shell were prepared by chemical reduction reaction. The thermal characteristics of Ag nanoparticle (NP) paste were measured by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The low-temperature sintering bonding processes using Ag NP paste were carried out at the temperature range of 150–350°C for 5 min under the pressure of 3 MPa. The microstructures of the sintered joint and the fracture morphology were evaluated by scanning electron microscopy (SEM). The shear strength was used to evaluate the mechanical property of the sintered joint. TGA-DSC test showed that the Ag content is approximately 95.5 mass% in Ag NP paste. The average shear strength of the joint fabricated at 250°C for 5 min under the pressure of 3 MPa was about 28 MPa, which could meet the requirements of electronics packaging working at high temperature. The joint shear strength increased with the increase of the sintering temperature due to much denser sintered Ag NPs and more comprehensive metallurgical bonds formed in the joint.

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“…The technical changeover of processes from tin-lead to lead-free assemblies was realized implementing lead-free solder materials (e.g. SAC305 [10]) as well as component finishes consisting of pure tin [11,12]. The coating of connector finishes and component leads with pure tin is similar to the tin-lead process, thus the implementation of a completely new procedure was not necessary [13,14].…”

Section: Introductionmentioning

confidence: 99%

The surface energies of β-Sn — A new concept for corrosion and whisker mitigation

Eckold

Sellers

Niewa

et al. 2015

Microelectronics Reliability

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Corrosion data provided under high-temperature and high-humidity conditions as well as tin whisker growth studies are explained by differences in the surface energy of lattice planes within the crystal structure of β-tin. For this purpose, electrodeposited tin finishes were investigated regarding their microstructure utilizing X-ray diffraction, cross-sectional SEM and EBSD analysis. The corrosion as well as the tin whisker propensity strongly depends on the preferred orientation of the surface finishes. With an increasing texture along the (211) lattice plane a decreasing corrosion and whisker propensity was observed, in contrary, the presence of the (101) and (112) textures results in an increased corrosion and whisker propensity. The maximum whisker length was reduced by one order of magnitude by changing the preferred orientation towards the (211) lattice plane of the tin finish. Modified embedded-atom method simulations of tin surfaces demonstrate the minimization of the surface energy of (211) surfaces, whereas the surface energies of the (101) and (112) Miller planes are increased. We find a strong connection between the minimization of surface energy and the corrosion and tin whisker propensity of electrodeposited tin finishes. To our best knowledge, this is the first study connecting the influence of the electrodeposition parameters on the corrosion and whisker propensity explained by calculations of the surface energies of

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Impact of the ROHS directive on high-performance electronic systems

Cited by 26 publications

References 14 publications

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Low‐Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

The surface energies of β-Sn — A new concept for corrosion and whisker mitigation

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