Abstract:The risk of damage caused by reballing SnPb eutectic solder balls onto a commercial off-the-shelf (COTS) active flip chip with a ball grid array (BGA) of SAC305 was studied. The effects of reballing performed by five different reballers were examined and compared. The active flip chip device selected included manufacturer specified resistance between eight (8) differential port pairs. The path resistance between these pins following reballing, as compared to an unreballed device, was used to assess damage accu… Show more
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