Impact of processing conditions and solder materials on surface mount assembly defects

Sidhu, R. S.; Aspandiar, Raiyo; Vandervoort, Steve; Amir, Dudi; Murtagian, Gregorio

doi:10.1007/s11837-011-0174-3

Cited by 18 publications

(6 citation statements)

References 15 publications

(12 reference statements)

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“…The first three issues with Pb-free electronics revolve around the solder alloy used to replace SnPb solder. First, most Pbfree solders require a higher reflow assembly process temperature compared with SnPb solder, which can create quality issues due to part and board warpage [5], [6]. Second, not surprisingly, the fatigue and fracture behavior of alternative Pb-free solder materials is different than that of SnPb solder.…”

Section: Concerns Associated With Pb-free Electronicsmentioning

confidence: 99%

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

et al. 2020

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Due to safety and reliability concerns, various classes and/or applications of electronic products are excluded from the European Union's Restriction of Hazardous Substances (RoHS) regulations requiring the elimination of lead (Pb). However, the majority of electronic devices are now Pb-free. As a result, manufacturers attempting to maintain tin-lead (SnPb) based electronics face an increasing challenge to procure parts and products with Pb-based solder. This paper reviews the challenges of producing Pbbased electronic equipment, the reliability concerns with Pb-free electronics, and the options that manufacturers have for maintaining reliable, Pb-based production. In particular, the paper examines mixed soldering processes and the re-balling of Pb-free electronic parts. While Pb-free electronics present risks, it is our conclusion that the risks are manageable and are lower than those incurred by maintaining an increasingly obsolete Pb-based manufacturing process.

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Section: Concerns Associated With Pb-free Electronicsmentioning

confidence: 99%

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

et al. 2020

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“…the occurrence of whiskers (threaded hair shapes up to 5ʅm in diameter and several millimeters long), short circuits caused by connecting several leads of the element with the solder metal as a result of the soldering process, and also due to human fault: incorrect selection of the soldering profile, which affects the quality of the connection, or a rapid increase in temperature, which, combined with moisture, leads to the formation of bubbles on the packaging (i.e. steam and other gases trapped in the packaging walls are the cause of delamination and cracking) [3][4][5]14].…”

Section: Introductionmentioning

confidence: 99%

The Use of IR Soldering Stations in the Process of Disassembling in BGA Packaging

Witkowski¹

2020

PAR

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“…The melting temperature (MP) for Sn-Ag-Cu Pb-free solder ranges from 217 °C to 221 °C and is far higher than 183 °C for Sn-37Pb eutectic solder, which means that a higher temperature will be required during assembling the components with boards. However, with continued shrinkage in size and thickness of electronic packaging, higher soldering temperature from Sn-Ag-Cu solder inevitably results in the thermal warpage on the thin or ultra-thin components [ 2 ]. To solve this reliability issue, development of Pb-free solder with MP close to or lower than Sn-37Pb solder is recently pursued in electronic industry [ 3 ].…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

et al. 2017

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Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi solid solution, Sn-30Bi and Sn-45Bi hypoeutectic and Sn-58Bi eutectic were selected in this work. The microstructure, interfacial reaction under soldering and subsequent aging and the shear properties of Sn-Bi solder joints were studied. Bi content in Sn-Bi solder had an obvious effect on the microstructure and the distribution of Bi phases. Solid solution Sn-Bi solder was composed of the β-Sn phases embedded with fine Bi particles, while hypoeutectic Sn-Bi solder was composed of the primary β-Sn phases and Sn-Bi eutectic structure from networked Sn and Bi phases, and eutectic Sn-Bi solder was mainly composed of a eutectic structure from short striped Sn and Bi phases. During soldering with Cu, the increase on Bi content in Sn-Bi solder slightly increased the interfacial Cu6Sn5 intermetallic compound (IMC)thickness, gradually flattened the IMC morphology, and promoted the accumulation of more Bi atoms to interfacial Cu6Sn5 IMC. During the subsequent aging, the growth rate of the IMC layer at the interface of Sn-Bi solder/Cu rapidly increased from solid solution Sn-Bi solder to hypoeutectic Sn-Bi solder, and then slightly decreased for Sn-58Bi solder joints. The accumulation of Bi atoms at the interface promoted the rapid growth of interfacial Cu6Sn5 IMC layer in hypoeutectic or eutectic Sn-Bi solder through blocking the formation of Cu6Sn5 in solder matrix and the transition from Cu6Sn5 to Cu3Sn. Ball shear tests on Sn-Bi as-soldered joints showed that the increase of Bi content in Sn-Bi deteriorated the shear strength of solder joints. The addition of Bi into Sn solder was also inclined to produce brittle morphology with interfacial fracture, which suggests that the addition of Bi increased the shear resistance strength of Sn-Bi solder.

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Impact of processing conditions and solder materials on surface mount assembly defects

Cited by 18 publications

References 15 publications

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption

The Use of IR Soldering Stations in the Process of Disassembling in BGA Packaging

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

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