Abstract:In the context of integrated circuits (ICs) development, package electrical modeling is a fundamental task for die-package-board system optimization. On high-speed digital devices, Ball Grid Array (BGA) package platform is often the preferred choice thanks to its layout flexibility, and Sparameter modeling approach provides the most accurate broadband description of this kind of structure. Since package S-parameters have a very small variation range, they are highly sensitive to extraction inaccuracy due to in… Show more
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