2010
DOI: 10.1063/1.3518308
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Impact of Morphological Features on the Dielectric Breakdown at SiO[sub 2]∕3C-SiC Interfaces

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Cited by 3 publications
(2 citation statements)
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References 11 publications
(17 reference statements)
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“…It can also distinguish differences within grains and at grain boundaries by nanoscale resolution. Eriksson et al [47] conducted local stress tests on SiO 2 /3C-SiC interfaces through C-AFM, and studied the influence of different defects on the breakdown electric field of devices. They found that step-bunching of different heights on the surface of 3C-SiC would lead to the increase of local electric field strength, resulting in the breakdown of devices.…”
Section: C-afmmentioning
confidence: 99%
“…It can also distinguish differences within grains and at grain boundaries by nanoscale resolution. Eriksson et al [47] conducted local stress tests on SiO 2 /3C-SiC interfaces through C-AFM, and studied the influence of different defects on the breakdown electric field of devices. They found that step-bunching of different heights on the surface of 3C-SiC would lead to the increase of local electric field strength, resulting in the breakdown of devices.…”
Section: C-afmmentioning
confidence: 99%
“…As an example, while the behavior of thin thermally grown oxides onto 4H-SiC is ideal [5,6], thicker thermal oxides (>10 nm) deviates from the ideal percolation theory, probably due to the presence of carbonrelated defects in the oxide [7,8]. Moreover, premature breakdown in SiO2/4H-SiC system has been also attributed to the presence of crystalline defects (pipes, carrots, bars, etc) [9], and to the step-bunching on the 4H-SiC surface [10,11]. Fig.…”
Section: Introductionmentioning
confidence: 99%