2004
DOI: 10.1049/el:20040021
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Impact of layer structure on performance of unpassivated AlGaN∕GaN∕SiC HEMTs

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Cited by 20 publications
(12 citation statements)
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“…dc and rf results of the HEMT devices are presented elsewhere. 8 Room temperature Hall effect measurements on the van der Pauw patterns ͑Table I͒ show the expected dependence on the carrier supply doping level. The sheet carrier density n Hall increases with increasing doping level while the mobility Hall is reduced.…”
Section: Institut Für Schichten Und Grenzflächen (Isg) and Cni-centermentioning
confidence: 87%
See 1 more Smart Citation
“…dc and rf results of the HEMT devices are presented elsewhere. 8 Room temperature Hall effect measurements on the van der Pauw patterns ͑Table I͒ show the expected dependence on the carrier supply doping level. The sheet carrier density n Hall increases with increasing doping level while the mobility Hall is reduced.…”
Section: Institut Für Schichten Und Grenzflächen (Isg) and Cni-centermentioning
confidence: 87%
“…On the other hand, this result supports our previous observation of better overall AlGaN/GaN HEMT performance using doped structure in comparison to undoped one. 8 …”
Section: Institut Für Schichten Und Grenzflächen (Isg) and Cni-centermentioning
confidence: 99%
“…The larger drain saturation current at the doped devices increases the power performance at low frequencies, e.g. at 2 GHz [3]. In this work we investigate the influence of a carrier supply layer on the small signal RF performance of MOCVD grown AlGaN/GaN HEMTs on SiC substrate.…”
Section: Introductionmentioning
confidence: 99%
“…The intentionally undoped structure consists of a 40 nm thick AlN nucleation layer, 3 µm GaN buffer, followed by a 30 nm Al 0.28 GaN barrier layer. Room temperature Hall measurements yield a 2DEG carrier concentration of 7.1x10 12 cm -2 and a mobility of 1835 cm 2 /V s. The devices are prepared using the standard HEMT fabrication process (for details see [7]). No mesa etching is performed to avoid a parasitic photocurrent created in the unshielded buffer between the contact pads.…”
mentioning
confidence: 99%