Impact of laser hole drilling on the breakage rate of multicrystalline silicon wafers

Laser processing of materials for renewable energy applications

“…Lee et al 45 used a single-mode Q-switched UV (355 nm) laser with a pulse duration of 40 ns for drilling holes for MWT silicon solar cells. Mingirulli et al 46 used both a Nd:YAG laser (1064 nm wave length) with pulse durations in the range of 60-90 μ s and a Yb:YAG laser (1030 nm wave length) with a pulse duration of 1 μ s to drill holes in Si wafers for EWT silicon solar cells.…”