Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH83 1999 Help me understand this report
Impact of intermetal dielectric process on Al via electromigration reliability
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2010
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Cited by 2 publications
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“…Process issues associated with low-k dielectrics can have significant impact on electromigration performance. Impact of Spin-on-glass™ (SOG) IMD process was reported, in which outgas of SOG at via was found to produce void and correspondingly degradation in electromigration performance [79].…”
Section: Degradation In Electromigration Performance Due To Low-k Diementioning
confidence: 99%
“…Process issues associated with low-k dielectrics can have significant impact on electromigration performance. Impact of Spin-on-glass™ (SOG) IMD process was reported, in which outgas of SOG at via was found to produce void and correspondingly degradation in electromigration performance [79].…”
Section: Degradation In Electromigration Performance Due To Low-k Diementioning
confidence: 99%
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