Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

Romdhane, Emna Ben; Guédon-Gracia, Alexandrine; Pin, S.; Roumanille, P.; Frémont, Hélène

doi:10.1016/j.microrel.2020.113812

Cited by 16 publications

(8 citation statements)

References 16 publications

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“…Meanwhile, the value of maximum von‐Mises stress is 16.30 MPa in type I, while 15.06 MPa in type II. These values are consistent with the work of Yang et al 53 and Ben et al 54 By using elastic constitutive model, they obtained a larger stress when the c ‐axis is parallel to the interface than perpendicular. Besides, these values indicate that cracks tend to occur in type I than type II from the view of larger stress causing cracks initiation more easily.…”

Section: Resultssupporting

confidence: 92%

A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading

Zhang

Liu

et al. 2022

Fatigue Fract Eng Mat Struct

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Based on crystal plastic theory, a novel thermomechanical constitutive model was proposed for Sn-rich solder. Material parameters of the proposed constitutive model were determined by fitting the stress-strain curves under uniaxial tensile testings. Combined with the proposed model and the material parameters, crystal plastic finite element method was used to investigate the effects of the microstructure features of grain orientation, grain boundary, and intermetallic compound on the fatigue behaviors of Sn-rich solder joint under the condition of thermal cycle loading. Results showed that the mean absolute percentage error between the simulation and experimental tensile curves was 3.50%, and the three microstructure features affected the fatigue behaviors of Sn-rich solder from different aspects, which were analyzed in detail. Besides, it was concluded that the proposed constitutive model could be effectively used to investigate the fatigue behaviors of Sn-rich solder joint from micro perspective.

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Section: Resultssupporting

confidence: 92%

A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading

Zhang

Liu

et al. 2022

Fatigue Fract Eng Mat Struct

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“…However, the MEMS sensor chip, as the core of the whole flow sensor system, suffers from degradation and a reduced reliability, which constitutes a major hazard to the safety performance of the system. Thus, the reliability of flow sensors under extreme conditions has been paid much more attention in recent years [11][12][13][14][15][16][17][18][19]. In addition, the reliability of electronic device systems, especially in regard to their performance with concerns for signal-processing system (SPS), has been reported very little, even though the SPS is one of the weakest components in the entire system [20][21][22].…”

Section: Introductionmentioning

confidence: 99%

“…The ADT is a good way of studying devices under extreme conditions, especially the step-stress accelerated degradation test (SSADT), which can set different temperatures during a finite test period time [10]. The performance degradation of high-temperature components, such as aero gas turbine engines and LEDs, has been illustrated, which was proved by experimental data [7][8][9][10][11][12][13][14][15]. However, the previous research has not considered the impacts caused by the stress conversion, or has assumed there is no effect.…”

Section: Introductionmentioning

confidence: 99%

A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test

Kang,

Lin,

Tao

2023

Sensors

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With the wide application of flow sensors, their reliability under extreme conditions has become a concern in recent years. The reliability of a Micro Electro Mechanical Systems (MEMS) flow sensor under temperature (Ts) is researched in this paper. This flow sensor consists of two parts, a sensor chip and a signal-processing system (SPS). Firstly, the step-stress accelerated degradation test (SSADT) is implemented. The sensor chip and the flow sensor system are tested. The results show that the biggest drift is 3.15% for sensor chips under 150 °C testing conditions, while 32.91% is recorded for the flowmeters. So, the attenuation of the SPS is significant to the degeneration of this flowmeter. The minimum drift of the SPS accounts for 82.01% of this flowmeter. Secondly, using the Coffin–Manson model, the relationship between the cycle index and Ts is established. The lifetime with a different Ts is estimated using the Arrhenius model. In addition, Weibull distribution (WD) is applied to evaluate the lifetime distribution. Finally, the reliability function of the WD is demonstrated, and the survival rate within one year is 87.69% under 85 °C conditions. With the application of accelerated degradation testing (ADT), the acquired results are innovative and original. This research illustrates the reliability research, which provides a relational database for the application of this flow sensor.

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“…Recently, with the miniaturization of electronic products, the reliability of solder joints has greatly concerned semiconductor and electronic product manufacturers [1][2][3]. Sn-Ag-Cu solders with good mechanical property and reliability are widely used in surface-mount technology (SMT) [4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy

Liu

Xue

et al. 2022

Crystals

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The Sn–Bi solder paste is commonly used in electronic assembly and packaging, but its brittleness causes poor reliability in shock environments. In this study, the mechanical reliability of Sn–Bi solder paste and Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was investigated with the board level drop test. The crack characterizations of solder joints were evaluated using a stereomicroscope after the dye and pull test. The microstructure characterization and failure types of solder joints were analyzed by a scanning electron microscope (SEM), and an energy dispersive spectrometer (EDS) was employed to investigate the initial phase identification and elemental analysis. Compared with Sn–Bi solder paste, the results show that the TSEP Sn–Bi solder pastes reduced the proportion of the complete failure and partial failure of the solder joints during the drop test. The microstructure observation of the crack path showed that the Sn–Bi/TSEP Sn–Bi solder joints were reinforced through the cured epoxy resin. The number of drops of the Sn–Bi/TSEP Sn–Bi-x (x = 3, 5, 7) solder joints had 1.55, 2.57, and over 3.00 times that of Sn–Bi/Sn–Bi solder joints after the board level drop test.

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Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

Cited by 16 publications

References 16 publications

A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading

A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading

A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test

Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy

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