Impact of Chipset Configuration on Thermal Performance of Smartphones

Yu, Youmin; Nikfar, Nader; Sutton, Todd

doi:10.1109/itherm.2018.8419463

Cited by 4 publications

(1 citation statement)

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“…Thermal management of electronic devices has been a hot topic and challenge because of the downsizing of devices and increasing of power density. There are many thermal management approaches such as circuits and systems for lowering power consumption and structures and materials for cooling [1]. Thermal placement optimization is a thermal design technique.…”

Section: Introductionmentioning

confidence: 99%

Thermal placement on PCB of components including 3D ICs

Satomi

Hachiya

Kanamoto

et al. 2020

IEICE Electron. Express

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In this letter, we propose a method for optimizing the thermal placement of heat and non-heat generating electronic components on a printed circuit board (PCB). Use a genetic algorithm to optimize the maximum temperature of the PCB and the total wire length between components. In the case that chips stacked in 3D ICs are reconfigurable, each chip construction of 3D ICs is also changed simultaneously. The temperature of each component is obtained by circuit simulation using a simple thermal circuit model. The experimental results demonstrate that the placement of components can be optimized well for lowering the maximum temperature with shorter wire lengths.

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Section: Introductionmentioning

confidence: 99%