2022
DOI: 10.3390/s22114087
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Impact of Chamber/Annealing Temperature on the Endurance Characteristic of Zr:HfO2 Ferroelectric Capacitor

Abstract: The endurance characteristic of Zr-doped HfO2 (HZO)-based metal–ferroelectric–metal (MFM) capacitors fabricated under various deposition/annealing temperatures in the atomic layer deposition (ALD) process was investigated. The chamber temperature in the ALD process was set to 120 °C, 200 °C, or 250 °C, and the annealing temperature was set to 400 °C, 500 °C, 600 °C, or 700 °C. For the given annealing temperature of 700 °C, the remnant polarization (2Pr) was 17.21 µC/cm2, 26.37 µC/cm2, and 31.8 µC/cm2 at the ch… Show more

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Cited by 13 publications
(12 citation statements)
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“…The extracted parameters regarding ferroelectric properties are summarized in table S1. As shown in figures 1(a)-(d), the increase in T dep causes the polarization characteristics to change from antiferroelectric to ferroelectric, and this trend agrees with the previously reported results using TiN electrodes [7][8][9]. However, the transition temperatures (corresponding to T dep ) of the capacitors with TiN and Mo electrodes are slightly different.…”
Section: Resultssupporting
confidence: 91%
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“…The extracted parameters regarding ferroelectric properties are summarized in table S1. As shown in figures 1(a)-(d), the increase in T dep causes the polarization characteristics to change from antiferroelectric to ferroelectric, and this trend agrees with the previously reported results using TiN electrodes [7][8][9]. However, the transition temperatures (corresponding to T dep ) of the capacitors with TiN and Mo electrodes are slightly different.…”
Section: Resultssupporting
confidence: 91%
“…Among the various process parameters required for the demonstration of ferroelectricity in Hf 1−x Zr x O 2 films, the atomic layer deposition (ALD) temperature (T dep ) is significant [7][8][9] because it primarily determines the initial phase of the film before the post-metallization annealing (PMA) process. The single-layered HfO 2 and ZrO 2 films have identical polymorphisms after crystallization, that is, t-and m-phases, depending on the film thickness and T dep [10,11], although ZrO 2 is more prone to crystallization than HfO 2 [12].…”
Section: Introductionmentioning
confidence: 99%
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“…Hafnia-based ferroelectrics have become the ferroelectric material of choice at ∼10 nm thickness [5][6][7], which is significant for nonvolatile ferroelectric random access memory [8,9], ferroelectric field effect transistor [10,11] as well as negative capacitance transistor applications [12,13] at the nanoscale. In particular, HZO is even more promising due to its low processing temperature (400 • C-450 • C) [14][15][16][17]. Compared with traditional perovskite ferroelectrics such as Pb(Zr,Ti)O 3 (PZT) [18], the greatest benefit of HZO lies in that it can well maintain net spontaneous polarization even below 10 nm thickness [19] while in PZT the formation of 180 • domains tends to eliminate the net polarization [20].…”
Section: Introductionmentioning
confidence: 99%