Impact of board configuration and shock loading conditions for board level drop test

Abstract

An effort has been made in this study to evaluate the dynamics and characteristics of the test vehicle in a board level drop test. A thorough understanding of the behavior of the test vehicle is examined by characterizing its response under different test profiles and board dimensions. This is done in an attempt to optimize the test procedure used to qualify electronic products subjected to high strain rate drop/shock environment.The effects of peak acceleration and change in velocity of the impact pulse on the reliability of the test vehicle have been studied. In situ strain measurements have been used to aid us in characterizing the board response under high strain rate loading conditions. Also finite element analysis has been used to better understand the board response under different loading conditions. Based on the experimental results and analysis, ways to improvise the drop test setup have been discussed.

A new and effective drop test evolution to next-gen handheld applications

“…1c and 1d will result in uniform strains and stresses across all components which would make the test much more efficient and data analysis much easier. This has been partially verified by P. Guruprasad et al [8] as shown in Fig. 1e.…”