IM7/LARCTM-IA polyimide composites

Hou, Tan-Hung; Johnston, Norman J.; Clair, Terry L. St.

doi:10.1088/0954-0083/7/1/009

Cited by 33 publications

(20 citation statements)

References 4 publications

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“…Upon comparing the T g s of nonpendent and zirconium pendent co‐PIs with that of LARC‐IA, which is 223°C,56 those of the co‐PIs synthesized in this research were much higher. The structural difference between the nonpendent co‐PI and LARC‐IA is the presence of MADA in the former.…”

Section: Resultsmentioning

confidence: 81%

“…The table shows that both nonpendent and zirconium pendent polymers had approximately the same imidization temperature and that the zirconium pendent polymers had lower thermal stabilities as anticipated52–54 but comparable with LARC‐IA 56. The co‐PIs with functional substituents on the pendent groups had thermal stabilities 5–28°C lower than that of the unsubstituted pendent co‐PI.…”

Section: Resultsmentioning

confidence: 98%

“…The use of limited concentrations of functional groups to control polymer chain interaction has not been extensively investigated 36, 47, 55. We chose to use co‐PAAs with 4,4′‐ODA/ODPA and 3,4′‐ODA/ODPA for this study because the structures of their homopolymers resemble those of Kapton™ and NASA's LARC‐IA (Langley Research Center‐Improved Adhesive),56 respectively.…”

Section: Introductionmentioning

confidence: 99%

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Pendent polyimides using mellitic acid dianhydride. III. The effect of pendent group functionality on polymer properties

Illingsworth

Wang

McCarney

et al. 2009

J of Applied Polymer Sci

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Methyl, methoxy, and nitrile (cyano) functional groups were incorporated into the metal-organic pendent group of a co-polyamic acid, co-PAA [(3,4 0 -ODA/ ODPA) 0.9 (3,4 0 -ODA/{MADA-p-Zr(adsp)(Rdsp)}) 0.1 ], in various locations to investigate their effects on polymer chain interactions and film quality. Proton nuclear magnetic resonance and gel permeation chromatography (GPC) performed on solutions of these products were consistent with the expected 10% (mol) functionalized pendent polymeric structures. Thermogravimetric analysis performed on ether-precipitated samples revealed little functional group effect on imidization temperature (decreases of 5-8 C), but showed a somewhat-greater effect on decomposition temperature (decreases of 6 C for the 3-methoxy derivative to 28 C for the methyl derivative). Differential scanning calorimetry performed on imidized powder samples showed that glass transition temperatures increased with the addition of the functional groups from 2 C for the methyl derivative to 19 C for the 3-methoxy derivative. Imidized films were solvent resistant, transparent, and flexible, with the nitrile derivative least susceptible to crack formation. Light scattering results revealed that the nitrile derivative had the lowest second virial coefficient of the functional groups tested and formed aggregates at room temperature in NMP with n ¼ 2, thus rationalizing its superior film forming properties. Results of contact angle measurements and atomic oxygen exposure of functionalized pendent co-PI films are included.

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Section: Resultsmentioning

confidence: 81%

Section: Resultsmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

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Pendent polyimides using mellitic acid dianhydride. III. The effect of pendent group functionality on polymer properties

Illingsworth

Wang

McCarney

et al. 2009

J of Applied Polymer Sci

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“…These systems display excellent fracture toughness and high modulus and have been extruded, compression molded, machined and polished neat, or filled with graphite, PTFE, and metal and ceramic powders. These thermoplastic polyimides are sold as rod, sheet, and film stock or as final stock parts and composites (232)(233)(234)(235)(236)(237)(238).…”

Section: Melt-processable Polyimidesmentioning

confidence: 99%

Polyimides

Bryant¹

2002

Encyclopedia of Polymer Science and Technology

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Polyimides are a class of high performance polymers that contain an imide group, defined as an sp 3 nitrogen bonded to two adjacent carbonyls. This imide structure is most commonly found as part of a five‐ or six‐membered ring. Polyimides are noted for their mechanical properties, chemical resistance, and dielectric strength. They exist as thermoplastics and thermosets. Polyimides are used as hot melt adhesives, matrix resins for composites, dielectric films, photoimageable coatings, flex circuits, foams, wire insulation, thin‐walled tubing, molding resins, and high performance bushings and seals. Products that compete with polyimides for niche applications include aerospace epoxies (Dow, Ciba, and Shell), cyanate resins (Dow), polysulfones (Solvay), filled polycarbonates and polyesters (Dow, Amoco, and GE), polybenzimidazoles (Hoechst‐Celanese), and some high T g filled phenolics. Although polyimides command a premium price, their versatility, reliability, and demonstrated performance make them suitable for use in high performance applications where failure and replacement costs are high.

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“…Melt flow can be enhanced by incorporation of more flexible units (e.g., O, CH 2 , C (CF 3 ) 2 ),7–12 by controlling the molecular weight and by reactive endcapped oligomers 13, 14. Especially, in recent years, polyimides derived from asymmetric dianhydride by varying the substituted position of the anhydride not only dramatically improved melt processability, but also possessed higher glass transition temperature compared with those from traditional dianhydride 15…”

Section: Introductionmentioning

confidence: 99%