III-V-on-Silicon Integration: From Hybrid Devices to Heterogeneous Photonic Integrated Circuits

Ramírez, Joan Manel; Elfaiki, Hajar; Vérolet, Théo; Besançon, Claire; Gallet, Antonin; Néel, Delphine; Hassan, Karim; Olivier, S.; Jany, Christophe; Malhouitre, Stéphane; Gradkowski, Kamil; Morrissey, Padraic E.; O’Brien, Peter; Caillaud, Christophe; Vaissière, Nicolas; Décobert, J.; Lei, Shenghui; Enright, Ryan; Shen, Alexandre; Achouche, M.

doi:10.1109/jstqe.2019.2939503

Cited by 107 publications

(68 citation statements)

References 52 publications

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“…The integration of III-V active optical components on silicon to form a photonic integrated circuit (PIC) is currently receiving a great deal of attention [209,210]. This interest is driven largely by telecommunications applications, for which relatively-mature near-IR PICs can combine lasers, detectors, resonators, modulators, couplers, multiplexers, etc.…”

Section: Photonic Integrated Circuits Incorporating Icls and Icdsmentioning

confidence: 99%

The Interband Cascade Laser

et al. 2020

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We review the history, development, design principles, experimental operating characteristics, and specialized architectures of interband cascade lasers for the mid-wave infrared spectral region. We discuss the present understanding of the mechanisms limiting the ICL performance and provide a perspective on the potential for future improvements. Such device properties as the threshold current and power densities, continuous-wave output power, and wall-plug efficiency are compared with those of the quantum cascade laser. Newer device classes such as ICL frequency combs, interband cascade vertical-cavity surface-emitting lasers, interband cascade LEDs, interband cascade detectors, and integrated ICLs are reviewed for the first time.

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Section: Photonic Integrated Circuits Incorporating Icls and Icdsmentioning

confidence: 99%

The Interband Cascade Laser

et al. 2020

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“… 5 − 7 Similar requirements can be envisaged for all-optical computing and telecommunications applications. 8 − 10 …”

Section: Introductionmentioning

confidence: 99%

Automated Nanoscale Absolute Accuracy Alignment System for Transfer Printing

McPhillimy

Jevtics

Guilhabert

et al. 2020

ACS Appl. Nano Mater.

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The heterogeneous integration of micro- and nanoscale devices with on-chip circuits and waveguide platforms is a key enabling technology, with wide-ranging applications in areas including telecommunications, quantum information processing, and sensing. Pick and place integration with absolute positional accuracy at the nanoscale has been previously demonstrated for single proof-of-principle devices. However, to enable scaling of this technology for realization of multielement systems or high throughput manufacturing, the integration process must be compatible with automation while retaining nanoscale accuracy. In this work, an automated transfer printing process is realized by using a simple optical microscope, computer vision, and high accuracy translational stage system. Automatic alignment using a cross-correlation image processing method demonstrates absolute positional accuracy of transfer with an average offset of <40 nm (3σ < 390 nm) for serial device integration of both thin film silicon membranes and single nanowire devices. Parallel transfer of devices across a 2 × 2 mm 2 area is demonstrated with an average offset of <30 nm (3σ < 705 nm). Rotational accuracy better than 45 mrad is achieved for all device variants. Devices can be selected and placed with high accuracy on a target substrate, both from lithographically defined positions on their native substrate or from a randomly distributed population. These demonstrations pave the way for future scalable manufacturing of heterogeneously integrated chip systems.

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“…This approach is suitable for IF modulation and circuitry and benefits from a strong compatibility with SiN, which is particularly popular for complex circuits and optical beamformers [42], [43], [45]. Thus, it is worth mentioning that significant progress has been made in the field of hybrid integration of III-V materials on silicon wafers [46], which could prove to be worth in the future as a solution for fully-integrated active/passive devices.…”

Section: Photonic Integration Of Arof Transmittersmentioning

confidence: 99%

Towards a Scaleable 5G Fronthaul: Analog Radio-over-Fiber and Space Division Multiplexing

Rommel

Dodane

Grivas

et al. 2020

J. Lightwave Technol.

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III-V-on-Silicon Integration: From Hybrid Devices to Heterogeneous Photonic Integrated Circuits

Cited by 107 publications

References 52 publications

The Interband Cascade Laser

The Interband Cascade Laser

Automated Nanoscale Absolute Accuracy Alignment System for Transfer Printing

Towards a Scaleable 5G Fronthaul: Analog Radio-over-Fiber and Space Division Multiplexing

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