2018
DOI: 10.1002/prep.201800142
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Ignition of Organic Explosive Materials by a Copper Oxide Film Absorbing a Laser Pulse

Abstract: This work present experimental results of PETN ignition and of numerical simulations of PETN, RDX, HMX, and TATB ignition by a copper oxide (CuO) film heated using a millisecond fiber laser YLS‐150. It was established that the dynamic ignition threshold of organic explosive materials (EM) in a three‐layer system (glass – CuO – EM) by a laser pulse has a minimum at the CuO film thickness of 12 μm . The density of the critical ignition energy of EM is increasing in the sequence of PETN, RDX, HMX, and TATB with P… Show more

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Cited by 7 publications
(15 citation statements)
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“…For example, for PETN at T s ¼ 590:0 K calculation by (21) gives z r � 2:6 mm, which is much less than the area of pre-explosion heating of EM (Figure 1) and is close to the results of numerical calculation (Figure 4). Figure 5 shows the results of experiments [20] on PETN ignition by an ytterbium fiber laser in a three-layer system…”
Section: Effect Of Decomposition Of Cuo Film On Ignition Of Organic Esupporting
confidence: 79%
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“…For example, for PETN at T s ¼ 590:0 K calculation by (21) gives z r � 2:6 mm, which is much less than the area of pre-explosion heating of EM (Figure 1) and is close to the results of numerical calculation (Figure 4). Figure 5 shows the results of experiments [20] on PETN ignition by an ytterbium fiber laser in a three-layer system…”
Section: Effect Of Decomposition Of Cuo Film On Ignition Of Organic Esupporting
confidence: 79%
“…Numerical calculations of the PETN dynamic ignition delay time for a three-layer system are consistent with the experiment with a CuO film thickness of about 9.0 μm [20,21]. In [21], in order to better describe the experiment on the dependence of the PETN dynamic ignition time on the thickness of the CuO film, it was proposed to take into account the endothermic reaction of the thermal decomposition of the CuO film. In this work, the endothermic effect was evaluated during the decomposition of copper oxide:…”
Section: Introductionsupporting
confidence: 57%
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