Identification of damage and fracture modes in power electronic packaging from experimental micro-shear tests and finite element modeling

Abstract

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Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages

“…In the literature, CZM has been implemented to simulate the many kinds of interfaces, including some applications related to polymers [ 8 ] and bonded joints [ 9 , 10 ]. Regarding power electronics applications, CZM has been used in copper-to-resin adhesion [ 11 ], solder joint interface delamination [ 12 ], the bonding/debonding behavior of bond pad structures [ 13 ], the debonding process of stiff film/compliant substrate systems [ 14 ], the failure mechanisms of stretchable electronics [ 15 ], the solder layer and semiconductor chip interface [ 16 ], and thermal fatigue [ 17 ], among others. Several approaches have been proposed in order to take into account the damage for fatigue loading, such as linking it to the maximum load the cycle [ 18 , 19 ] or the maximum principal strain [ 20 ] or including an unloading–reloading relation [ 21 , 22 ].…”

“…Moreover, very often, asymmetric geometries are adopted. Then, upon experiencing stresses due to temperature variations induced by operative working conditions, Materials 2023, 16, 4808 2 of 12 these components suffer from warpage issues [3,4]. One of the most critical failure mechanisms is delamination [5].…”