Identification and quantification of FOUP molecular contaminants inducing defects in integrated circuits manufacturing

Nguyen, Thi Quynh; Fontaine, Hervé; Borde, Yannick; Jacob, VéRonique

doi:10.1016/j.mee.2012.04.008

Cited by 24 publications

(22 citation statements)

References 4 publications

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“…Thi Quynh Nguyen [1], Paola G. [2] and al. established new experimental protocol to quantify the cross-contaminantion for each material constituent of the FOUP in order to choice the optimal material versus contaminant.…”

Section: Physical Problem and Experiments Procedures 21 Foup's Geometrymentioning

confidence: 99%

“…These contaminations can potentially cause defects in devices performance. The wafer carrier and storage play an important role for contamination control [1]- [2]. The Front Unified Pods (FOUPs) is used to transport wafers from one point to another point and to protect the wafer with contamination [2]- [3].…”

Section: Introductionmentioning

confidence: 99%

“…The wafer post processed contamines the pods with volatile acids and contamines news wafer and vice-versa [4], [5]- [6]. The FOUP is made with a porous polymers materials well-known with its adsorption and outgass properties [1]- [2], [5]- [6]. These physical phenomena are traduced by sorption phenomena as adsorption and desorption [7], [8].…”

Section: Introductionmentioning

confidence: 99%

“…These physical phenomena are traduced by sorption phenomena as adsorption and desorption [7], [8]. They are also able to absorb volatile compounds present in their atmosphere coming from the connection to an equipment or from the release of wafers post processed [1]- [4], [9]. These phenomena result a reversible and a irreversible outgassing of contaminant previously trapped in polymer [9], [10], [11].…”

Section: Introductionmentioning

confidence: 99%

“…In microelectronics industry, this process takes place generally at the FOUPs who contains the wafer before and after fabrication process [2], [4]. Some fabrication method is the source of contamination, when the wafer is already processed its surface is contamined by the volatile acids [1]. The wafer is the exposed to the FOUP's atmosphere and a volatile acid contamination may happened from wafer to FOUP [2].…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Dynamic boundary conditions for a coupled convection-diffusion model with heat effects: applications in cross-contamination control

Santatriniaina¹,

Deseure²,

Nguyen³

et al. 2015

IJAMR

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This work investigates the mass transfer of the Airborne Molecular cross Contamination (AMCs) between the Front Opening Unified Pod (FOUP) and wafer (silicon substrates) during the microelectronics devices manufacturing using dynamic boundary conditions. Such cross-contamination phenomena lead to detrimental impact on production yield in microelectronic industry and a predictive approach using modelling and computational methods is a very strong way to understand and qualify the AMCs cross contamination processes. The FOUP is made of polymeric materials and it is considered as a heterogeneous porous media, it can asorb and desorb the contaminant, thus the modelled processes are the contamination of two-component in transient flow. Coupled diffusion and convection-diffusion model with heat effects are used to define the phenomena. The present methodology is, first using the optimization methods with the numerical solution in order to define the physical constants of various materials which have been studied experimentally and separately, and the second using the finite element methods including these physical constants and relevant interface condition in order to take into account the adsorption kinetics law. Numerical methods to solve the problem are proposed. The dynamics behavior of the AMCs analysis was determined thanks to the switch of Dirichlet to Neumann condition. The mathematical model preserves the classical forms of the diffusion and convection diffusion equations and yields to consistent form of the Fick's law. The computed results are in correlation with the experimental measurements. Some numerical results are presented in this work.

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Section: Physical Problem and Experiments Procedures 21 Foup's Geometrymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%