IBM BladeCenter system electrical packaging design challenges

Patel, P.; Hughes, Joseph; Herman, B.; Cases, M.; Araujo, D.N. de; Pham, N.

doi:10.1109/epep.2004.1407530

Cited by 12 publications

(7 citation statements)

References 2 publications

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“…channel lengths. [1] The Molex SEARAYTM connector is the "con. 1" in the figure below and is a possible source of crosstalk noise.…”

Section: System Overviewmentioning

confidence: 99%

Crosstalk Measurement, Extraction and Validation in 10Gbps Serial Systems

Patel¹,

Ahmed²,

Herrman³

et al. 2007

2007 IEEE Electrical Performance of Electronic Packaging

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The goal of this paper is to describe some of the design choices made in a BladeCenter system design. This paper will focus on the connector modeling that was used to make design trade-offs, unique to a 1OGbps serial system. Connectors are a significant source of crosstalk noise in a system, which could increase jitter in the resulting eye pattern. Since crosstalk jitter is uncorrelated from the link data pattern, it is hard to remove through equalization techniques. This paper provides a process to extract accurate coupled models from connectors. It also describes how modeling was used to predict crosstalk noise and shows how a small percentage of connector crosstalk can have a significant impact on the over all signal distortion, if the connector pin assignment is done randomly IntroductionDesign choices in a Blade Center backplane system are based on simulation models. Accurate simulation models are critical to making good design trade-offs, especially in 1OGbps serial systems. Typically, models for several components provided by external suppliers have limited accuracy. As serial link speeds have increased, minimizing crosstalk has become a major Signal Integrity challenge. In a 1OGbps system connector crosstalk can be a significant jitter contributor if the connector pin assignment is done randomly. However, the effect on the overall system can be reduced by following certain design guidelines.This paper provides a process to extract accurate connector crosstalk models. The Molex SEARAYTM connector was evaluated to determine its suitability in the high speed backplane system. As shown in Figure 1 below, the BladeCenter interconnects are card to card high speed channels, which enable system compatibility between shared devices. The backplane in a blade system can be defined as a flexible interface to attach shared devices such as processor blades, switches, management modules, etc.Two different techniques were used to measure the near end and far end crosstalk contribution of the connector. The correlation of crosstalk measurement techniques was done using a VNA in the Frequency domain and a TDR in the Time domain. This procedure validated the connector crosstalk measurements, which with a high confidence to see the impact of connector cross talk.In addition to characterizing the crosstalk contribution of the connector by itself, a channel simulation using the StatEye tool was performed using the validated coupled models that were created by exporting measured frequency domain data into the touchstone format.

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“…channel lengths. [1] The Molex SEARAYTM connector is the "con. 1" in the figure below and is a possible source of crosstalk noise.…”

Section: System Overviewmentioning

confidence: 99%

Crosstalk Measurement, Extraction and Validation in 10Gbps Serial Systems

Patel¹,

Ahmed²,

Herrman³

et al. 2007

2007 IEEE Electrical Performance of Electronic Packaging

Self Cite

View full text Add to dashboard Cite

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“…to support future semiconductor generations scaling requirements for higher I/O and higher wiring density and due to coefficient of thermal expansion match to silicon chips, the benefit to minimize stress for low k dielectric and fine pitch interconnections. Figure 5 shows a comparison of bandwidth across packaging substrates including printed wiring board (PWB), ceramic, organic and silicon carrier packaging [11,12]. Bandwidth can be represented as the multiplication of wiring channels per defined edge width by the acceptable frequency of each wire or channel per targeted line length.…”

Section: High Density Electrical Wiring and Voltage Distributionmentioning

confidence: 99%

“…Lines were measured for signal integrity including S parameters and cross talk. Results have been summarized into design guidelines [10,11]. Figure 4 shows a comparison of both the increase in chip I/O density and wiring density per layer for silicon carrier packaging compared to traditional ceramic and organic packaging.…”

Section: High Density Electrical Wiring and Voltage Distributionmentioning

confidence: 99%

See 1 more Smart Citation

System-on-Package (SOP) Technology, Characterization and Applications

Knickerbocker

Andry

Buchwalter

et al.

56th Electronic Components and Technology Conference 2006

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A silicon-based system-on-package (SOP) is described. Novel capabilities of SOP are expected to enable lower cost, more efficient and higher performance electronic systems. Newly developed technology elements include: electrical silicon through-vias, fine-pitch, high bandwidth wiring, fine pitch solder interconnection, fine pitch known-good-die, and advanced microchannel cooling. Applications may range from miniaturized consumer products such as integrated function cell phones to high performance computers.

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“…The solution to remove the heat was the 325 cubic feet per minute (CFM) redundant blowers, thermal monitor's locations and the Management Module. [5] The redundant vectored cooling system is a leading edge design that draws air through from front to back to ensure effective cooling of a fully populated chassis, both now and in the future as more powerful processors are introduced. Airflow is from front to rear as shown in Figure 3.…”

Section: Thermal Design Overview and Challengesmentioning

confidence: 99%

Data center server packaging technology

Patel

Herrman

Hughes

et al.

IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.

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The purpose of this paper is to describe BladeCenterTM packaging technology and compare with lU and 2U rack systems to illustrate the improvements. The power and thermal design challenges are described. The paper covers in detail power and thermal design advantages, and overall cost performance compared to IU servers.A blade server is a rack-optimized server architecture designed to include the benefits of standardized IU rack systems while eliminating the complications associated with these systems. The term BladeCenter refers to a chassis that can hold a number of hot-swappable devices called blades server. A blade sever is an independent server containing one or more processors, memory, disk storage, and network controllers The BladeCenter was created to simplify the deployment of servers in an enterprise infrastructure.

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IBM BladeCenter system electrical packaging design challenges

Cited by 12 publications

References 2 publications

Crosstalk Measurement, Extraction and Validation in 10Gbps Serial Systems

Crosstalk Measurement, Extraction and Validation in 10Gbps Serial Systems

System-on-Package (SOP) Technology, Characterization and Applications

Data center server packaging technology

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