In-situ volumetric topography of IC chips for defect detection using infrared confocal measurement with active structured light

Abstract

The article presents the development of in-situ integrated circuit (IC) chip defect detection techniques for automated clipping detection by proposing infrared imaging and full-field volumetric topography. IC chip inspection, especially held during or post IC packaging, has become an extremely critical procedure in IC fabrication to assure manufacturing quality and reduce production costs. To address this, in the article, microscopic infrared imaging using an electromagnetic light spectrum that ranges from 0.9 to 1.7 µm is developed to perform volumetric inspection of IC chips, in order to identify important defects such as silicon clipping, cracking or peeling. The main difficulty of infrared (IR) volumetric imaging lies in its poor image contrast, which makes it incapable of achieving reliable inspection, as infrared imaging is sensitive to temperature difference but insensitive to geometric variance of materials, resulting in difficulty detecting and quantifying defects precisely. To overcome this, 3D volumetric topography based on 3D infrared confocal measurement with active structured light, as well as light refractive matching principles, is developed to detect defects the size, shape and position of defects in ICs. The experimental results show that the algorithm is effective and suitable for in-situ defect detection of IC semiconductor packaging. The quality of defect detection, such as measurement repeatability and accuracy, is addressed. Confirmed by the experimental results, the depth measurement resolution can reach up to 0.3 µm, and the depth measurement uncertainty with one standard deviation was verified to be less than 1.0% of the full-scale depth-measuring range.

Research on spectral confocal displacement measurement method based on machine learning

“…CCT uses the principle of light dispersion, broad-spectrum light source through the dispersive objective lens in the axial direction to produce chromatic aberration, the back end through the spectrometer to detect the *lz516089@163.com; phone:18339698260 *lz516089@163.com; phone:18339698260 reflected focused light, through the computer inverse solution of the spectral peak can get the precise axial position, through the axial and longitudinal scanning can get the object surface profile [4,5] , thickness, displacement, and other information. Spectral confocal measurement techniques are now widely used in industrial precision manufacturing [6] , biomedical [7] , and circuit defect detection [8] due to their small size, high accuracy, and high speed.…”

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