In this work, we report a new and
promising approach toward the
atomic layer deposition (ALD) of metallic Co thin films. Utilizing
the simple and known CoCl2(TMEDA) (TMEDA = N,N,N′,N′-tetramethylethylenediamine) precursor in combination with
the intramolecularly stabilized Zn aminoalkyl compound Zn(DMP)2 (DMP = dimethylaminopropyl) as an auxiliary reducing agent,
a thermal ALD process is developed that enables the deposition of
Zn-free Co thin films. ALD studies demonstrate the saturation behavior
of both precursors and linearity depending on the applied number of
cycles as well as temperature dependency of film growth in a regime
of 140–215 °C. While the process optimization is carried
out on Si with native oxide, additional growth studies are conducted
on Au and Pt substrates. This study is complemented by initial reactivity
and suitability tests of several potential Zn alkyl-reducing agents.
For the CoCl2(TMEDA)–Zn(DMP)2 combination,
these findings allow us to propose a series of elemental reaction
steps hypothetically leading to pure Co film formation in the ALD
process whose feasibility is probed by a set of density functional
theory (DFT) calculations. The DFT results show that for reactions
of the precursors in the gas phase and on Co(111) substrate surfaces,
a pathway involving C–C coupling and diamine formation through
reductive elimination of an intermediate Co(II) alkyl species is preferred.
Co thin films with an average thickness of 10–25 nm obtained
from the process are subjected to thorough analysis comprising atomic
force microscopy, scanning electron microscopy, and Rutherford backscattering
spectrometry/nuclear reaction analysis as well as depth profiling
X-ray photoemission spectroscopy (XPS). From XPS analysis, it was
found that graphitic and carbidic carbon coexist in the Co metal film
bulk. Despite carbon concentrations of ∼20 at. % in the Co
thin film bulk, resistivity measurements for ∼22 nm thick films
grown on a defined SiO2 insulator layer yield highly promising
values in a range of 15–20 μΩ cm without any postgrowth
treatment.