2020
DOI: 10.1021/acs.chemmater.0c01003
|View full text |Cite
|
Sign up to set email alerts
|

In Situ Reaction Mechanism Study on Atomic Layer Deposition of Intermetallic Co3Sn2 Thin Films

Abstract: In this work, a growth mechanism of an intermetallic Co3Sn2 thin film is studied in situ with a quartz crystal microbalance (QCM) and quadrupole mass spectrometer (QMS). The film is deposited by atomic layer deposition (ALD) from CoCl2(TMEDA) and Bu3SnH precursors (TMEDA = N,N,N′,N′-tetramethylethylenediamine). Balanced reaction equations are resolved by fitting the QMS and QCM data, and a step-by-step growth mechanism is determined for the process. During the CoCl2(TMEDA) pulse, only 1-chlorobutane is formed … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
7
0

Year Published

2021
2021
2023
2023

Publication Types

Select...
5
1

Relationship

1
5

Authors

Journals

citations
Cited by 7 publications
(7 citation statements)
references
References 59 publications
0
7
0
Order By: Relevance
“…In the beginning, the reaction of gaseous CoCl2(TMEDA) with the surface might be best described by physisorption of CoCl2 with release of the coordinating TMEDA as shown in (I) and suggested in recent ALD literature. 45 When Zn(DMP)2 is then pulsed in after a purge, it may engage in ligand exchange reactions with surface adsorbed CoCl2 producing an intermediate Co(II) aminoalkyl species and ZnCl2 (II). ZnCl2 would leave the surface as a volatile by-product.…”
Section: Surface Reaction Pathwaysmentioning
confidence: 99%
See 1 more Smart Citation
“…In the beginning, the reaction of gaseous CoCl2(TMEDA) with the surface might be best described by physisorption of CoCl2 with release of the coordinating TMEDA as shown in (I) and suggested in recent ALD literature. 45 When Zn(DMP)2 is then pulsed in after a purge, it may engage in ligand exchange reactions with surface adsorbed CoCl2 producing an intermediate Co(II) aminoalkyl species and ZnCl2 (II). ZnCl2 would leave the surface as a volatile by-product.…”
Section: Surface Reaction Pathwaysmentioning
confidence: 99%
“…43 To address this crucial drawback, we present for the first time the ALD of metallic, Zn-free Co thin films using, intramolecularly stabilized Zn precursor Zn(DMP)2 44 (DMP = N,N-3-(dimethylamino)propyl) with the Co precursor CoCl2(TMEDA) (TMEDA = N,N,N',N'-tetramethylethylenediamine) that has previously been used for ALD of intermetallic thin films. 45,46 The precursor pair was chosen based on the precedence for the formation of thermally labile Co(DMP)2 species in solution, 47 a bulk reactivity study with the neat reagents, as well as matching thermal properties that facilitate their usage in an F-120 ALD reactor. As a first step, a reactivity screening of several potential precursor combinations (see Scheme 1) comprising the wellknown Zn(Et)2 43 as well as its less known amine stabilized congener Zn(Et)2(TMEDA) 48 is carried out.…”
Section: Introductionmentioning
confidence: 99%
“…32 The neutral TMEDA adduct ligand makes the non-volatile cobalt(II) chloride volatile, while it has little effect on the deposition chemistry. 32,34 Thermodynamically, the reactions between CoCl2 and H2S producing cobalt sulfide in different possible stoichiometries (Co9S8, CoS, Co3S4, and CoS2) are favorable with similar ∆G values of approximately -125 to -145 kJ/mol of CoCl2 at 180-300 °C (Section S1 in the Supporting Information). Thus, the corresponding ALD surface reactions of our process are also likely to be very favorable.…”
Section: Film Depositionmentioning
confidence: 99%
“…32 ) and Co3Sn2 (Ref. 33,34 ) thin films. In this article, CoCl2(TMEDA) is used with H2S to deposit crystalline Co9S8 films with a low resistivity on the order of 100 μΩcm.…”
Section: Introductionmentioning
confidence: 99%
“…To address this crucial drawback, we present for the first time the ALD of metallic, Zn-free Co thin films using intramolecularly stabilized Zn precursor Zn­(DMP) 2 (DMP = N , N -3-(dimethylamino)­propyl) with the Co precursor CoCl 2 (TMEDA) (TMEDA = N , N , N ′, N ′-tetramethylethylenediamine) that has previously been used for ALD of intermetallic thin films. , The precursor pair was chosen based on the precedence for the formation of thermally labile Co­(DMP) 2 species in solution and a bulk reactivity study with the neat reagents, as well as matching thermal properties that facilitate their usage in an F-120 ALD reactor. As a first step, a reactivity screening of several potential precursor combinations (see Scheme ) comprising the well-known Zn­(Et) 2 as well as its less-known amine-stabilized congener Zn­(Et) 2 (TMEDA) is carried out.…”
Section: Introductionmentioning
confidence: 99%