<i>In situ</i> mechanical testing of templated carbon nanotubes

Lu, Shaoning; Guo, Zaoyang; Ding, Weiqiang; Dikin, Dmitriy A.; Lee, Junghoon; Ruoff, Rodney S.

doi:10.1063/1.2400212

Cited by 33 publications

(21 citation statements)

References 33 publications

(33 reference statements)

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“…Nanomaterials can be fabricated directly on MEMS devices [9], [30]. Presynthesized nanomaterials were also transferred onto MEMS devices via dielectrophoresis trapping [12], [22], [31], focused-ion-beam deposition [14], and direct pick and place [11], [13], [17], [20], [32]- [35]. Due to the flexibility of pick-and-place nanomanipulation inside SEM and no need for nanomaterial preprocessing (e.g., sonication), we transferred individual silicon nanowires from growth substrates onto MEMS devices via direct pick and place.…”

Section: B Transfer Of Nanowire Onto Mems Devicementioning

confidence: 99%

Piezoresistivity Characterization of Synthetic Silicon Nanowires Using a MEMS Device

Zhang

Liu

et al. 2011

J. Microelectromech. Syst.

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Abstract-This paper presents a microelectromechanical systems (MEMS) device for simultaneous electrical and mechanical characterization of individual nanowires. The device consists of an electrostatic actuator and two capacitive sensors, capable of acquiring all measurement data (force and displacement) electronically without relying on electron microscopy imaging. This capability avoids the effect of electron beam (e-beam) irradiation during nanomaterial testing. The bulk-microfabricated devices perform electrical characterization at different mechanical strain levels. To integrate individual nanowires to the MEMS device for testing, a nanomanipulation procedure is developed to transfer individual nanowires from their growth substrate to the device inside a scanning electron microscope. Silicon nanowires are characterized using the MEMS device for their piezoresistive as well as mechanical properties. It is also experimentally verified that e-beam irradiation can significantly alter the characterization results and must be avoided during testing.[2011-0031]

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Section: B Transfer Of Nanowire Onto Mems Devicementioning

confidence: 99%

Piezoresistivity Characterization of Synthetic Silicon Nanowires Using a MEMS Device

Zhang

Liu

et al. 2011

J. Microelectromech. Syst.

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“…Haque et al [4] presented a system in an SEM chamber to test the nanoscale freestanding thin film where the tensile force was measured by a deflected thin beam. Meanwhile, similar principle was employed by Li et al [5] and Lu et al [6], where Li used double-field-of-view electronic speckle pattern interferometry (ESPI) and deflected beam to real-time measure the tensile deformation of thin films, and Lu employed a MEMS based tensile stage consisting of a load sensing beam and the electrodes to in situ axial load a templated carbon nanotube inside a scanning electron microscope (SEM). The deflected beam type force sensors have advantages of expediently adjusting the force range by selecting the beam's material and geometry, and easily adapting to test system and specimens.…”

Section: Introductionmentioning

confidence: 96%

Investigation of loading and force sensing properties of a probe-type microforce sensor with force-distance curves

Sun

Diao

2011

Sci. China Technol. Sci.

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In this paper, the force-distance curves have been employed to investigate the force sensing properties of the probe-type microforce sensors. In the preliminary studies, two kinds of probe-type microforce sensors have been used to load the objects with dry and wetted surfaces. One is a developed piezoresistive cantilever force sensor with sensitivity of 35 N/V and the other an atomic force microscope (AFM) cantilever beam probe with sensitivity of 10.4 nN/V. The force outputs corresponding to the regimes of approaching, indenting, and loading are obtained, and the properties of the stability in the approaching regime of the sensors, local mechanical behavior of the tested objects in the indenting regime, and the force sensing of the global samples are analyzed. Experimental results of this analysis are also presented.force sensor, probe, force-distance curve, mechanical behavior, surface effects Citation:Sun C, Su D C, Li X D. Investigation of loading and force sensing properties of a probe-type microforce sensor with force-distance curves.

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“…A micro-tensile system based on magnet-coil force actuator was presented by Hua [5], which used the DIC method for strain measurement. Guo [6] and his partner present a new MEMS device composed of an actuation unit, direct force-sensing beams, and integrated electrodes for dielectrophoretic deposition of nanostructures. With the device the templated carbon nanotubes were test in SEM.…”

Section: Introductionmentioning

confidence: 99%

Study on the mechanical properties of TiNi shape memory alloy wires using mark shearing system

et al. 2009

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The Shape memory alloys (SMAs) wires have been used for medical and engineering filed due to the shape memory effect and the superelasticity effect. It is necessary to measure the mechanical properties of the SMA wires accurately. In this paper the mechanical properties of the shape memory alloy wires with different diameters were studied by a self-made testing system. A loading apparatus driven by step motor was used to apply load, and a load cell with the accuracy of 10 mN and the capacity of 90N was used to measure the value of the load. An optical extensometer based on the mark shearing method was used to measure the strain of the SMA wires, which had accuracy with 5 micron-strains in strain measurement. The mechanical properties of the shape memory alloy wires were studied. The nominal stress-strain curves of the SMA wires were acquired. The superelasticity effect was also studied. The successful experimental results also demonstrated the feasibility of the system in silk-like specimen measurement.

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In situ mechanical testing of templated carbon nanotubes

Cited by 33 publications

References 33 publications

Piezoresistivity Characterization of Synthetic Silicon Nanowires Using a MEMS Device

Piezoresistivity Characterization of Synthetic Silicon Nanowires Using a MEMS Device

Investigation of loading and force sensing properties of a probe-type microforce sensor with force-distance curves

Study on the mechanical properties of TiNi shape memory alloy wires using mark shearing system

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