Abstract:Abstract:We investigated the microstructural evolution of Sn 96.4 Ag 2.8 Cu 0.8 solder through in situ heating transmission electron microscopy observations. As-soldered bump consisted of seven layers, containing the nanoeutectic lamella structure of AuSn and Au 5 Sn phases, and the polygonal grains of AuSn 2 and AuSn 4 , on Au-plated Cu bond pads. Here, we found that there are two nanoeutectic lamellar layers with lamella spacing of 40 and 250 nm. By in situ heating above 1408C, the nanoeutectic lamella of Au… Show more
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