2007
DOI: 10.1557/proc-1035-l04-01
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Hydrothermally Grown Single-Crystalline Zinc Oxide; Characterization and Modification

Abstract: An overview of our recent results on characterization and modification of high-resistivity n-type bulk zinc oxide samples, grown by hydrothermal techniques, is given. Three specific topics are addressed; (i) the role of lithium (Li) as an electrically compensating impurity, (ii) extrinsic n-type doping by hydrogen implantation, and (iii) influence of annealing conditions on deep band emission. In (i), furnace annealing of as-grown samples at temperatures above ~800 °C is shown to cause out-diffusion of residua… Show more

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Cited by 11 publications
(20 citation statements)
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“…Li is, indeed, one of the main candidates, and it has been proposed that its amphoteric behavior results in self-compensation and an increase in the resistivity [5]. Thus, Li Zn is considered a major contributor to [E A ] [21], which is strongly substantiated by the correlation between the present TAS/TDH data ( Fig. 2 and Table II) and the SIMS data in Fig.…”
Section: Influence Of LI and Other Residual Impuritiessupporting
confidence: 79%
“…Li is, indeed, one of the main candidates, and it has been proposed that its amphoteric behavior results in self-compensation and an increase in the resistivity [5]. Thus, Li Zn is considered a major contributor to [E A ] [21], which is strongly substantiated by the correlation between the present TAS/TDH data ( Fig. 2 and Table II) and the SIMS data in Fig.…”
Section: Influence Of LI and Other Residual Impuritiessupporting
confidence: 79%
“…Wafers C and D were heat treated before ion implantation (preannealed) at 1500 • C to reduce the amount of Li by at least two orders of magnitude. 19 Note that the preannealing causes an increase in the Na background concentration from <10 15 cm −3 (wafers A and B) to the 10 16 cm −3 range (wafers C and D) due to furnace contamination. A standard mechanical polishing process using diamond slurry with grain size from 5 μm down to 0.25 μm on rotating nylon suspension disks followed the preanneals of the wafers C and D in order to restore the surface quality.…”
Section: Methodsmentioning
confidence: 99%
“…If the concentration of Na incorporated beyond the implanted region would be determined by the Na Zn formation energy, one would expect similar concentrations in diffusion tails for wafers C and D as for wafers A and B provided that the E F position is the same. However, E F is high in the bulk of wafers C and D due to the lower Li concentration remaining after preannealing at 1500 • C. 19 Hence the concentration of Na i , assumed to be the mobile species, is highly suppressed in the bulk of wafers C and D and out-diffusion via the surface prevails. However, it is likely that a low diffusion flux of Na i toward the bulk still exists, as corroborated by the depletion of Li from the mid-10 15 to the mid-10 14 cm −3 range in depth interval ∼0.5-1.5 μm for sample D 3, Fig.…”
Section: A Na Configurations and Its Interplay With LI In Znomentioning
confidence: 99%
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“…This excludes unambiguously that implantation-induced ͑intrinsic͒ defects only are responsible for the Li redistribution observed in Fig. 1 The high resistivity of the HT ZnO wafers used indicate that Li acts as acceptor 19 predominantly residing on zinc site. On the other hand, the implanted Na is probably randomly distributed existing in different configurations, e.g., clusters and precipitates, of limited temperature stability.…”
mentioning
confidence: 86%